M2S050-FG896

This SoC is built on ARM? Cortex?-M3 core processor(s).

Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Package 896-BGA is assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.There is one thing to note about this SoC security: it combines FPGA - 50K Logic Modules.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 377 I/Os.As for its flash size, it is 256KB.You can get system on chips with similar specs and purposes by searching M2S050.A wireless SoC that operates at a frequency of 166MHz is what the wireless SoC does.In terms of core architecture, the SoC meaning relies on ARM.In order for the SoC computing to start up, 0°C is sufficient.There is a design maximum operating temperature 85°C specified for this SoC system on chip.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S050-FG896 System On Chip (SoC) applications.

• Central inverter
• Wireless networking
• CNC control
• High-end PLC
• DC-input BLDC motor drive
• Mobile computing
• Central alarm system
• Industrial robot
• Temperature Sensors
• USB hard disk enclosure