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M2S060T-1FCS325I

325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060T-1FCS325I
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 852
  • Description: 325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.There is a 325-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.SmartFusion?2 is the series number of this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.This SoC security combines FPGA - 60K Logic Modules, an important feature to keep in mind.A state-of-the-art Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 200.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.There is a possibility that it can be powered by a power supply of at least 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.In total, there are 325 terminations, which makes system on a chip possible.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.The SoC chip that comes with this module can be configured to have 200 outputs.There is 1.2V power supply requirement for this system on chip SoC.This SoC chip is equipped with 200 inputs for the user to choose from.56520 logic cells are included in logic system on chips.There is a flash of 256KB on it.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S060T-1FCS325I System On Chip (SoC) applications.

  • Defense
  • Mobile market
  • sequence controllers
  • Industrial automation devices
  • Networked Media Encode/Decode
  • Smartphones
  • Digital Signal Processing
  • Central alarm system
  • Communication interfaces ( I2C, SPI )
  • Temperature Sensors