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M2S090TS-1FCSG325

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090TS-1FCSG325
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 651
  • Description: 325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 1.16mm
Length 13.5mm
Width 11mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines FPGA - 90K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 180 I/Os.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.It is really beneficial to have system on a chip since there are 325 terminations in total.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.A SoC chip like this can have 180 outputs.As far as power supplies are concerned, system on chip requires 1.2V.A SoC chip with 180 inputs is available.86316 logic cells are present in logic system on chips.It has a 512KB flash.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S090TS-1FCSG325 System On Chip (SoC) applications.

  • Avionics
  • Wireless sensor networks
  • Industrial
  • Multiprocessor system-on-chips (MPSoCs)
  • Industrial Pressure
  • Automotive gateway
  • Keyboard
  • Central alarm system
  • Mobile computing
  • Communication network-on-Chip (cNoC)