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M2S100-1FC1152

0°C~85°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S100-1FC1152
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 989
  • Description: 0°C~85°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

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Details

Tags

Parameters
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish TIN LEAD
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S100
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 100K Logic Modules
Number of Logic Cells 99512
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Package 1152-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 100K Logic Modules.Tray package houses this SoC system on a chip.574 I/Os in total are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.As long as it receives a power supply that is at least 1.14V, it should be able to function.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.Using this SoC chip, you have the option of having 574 outputs.In order to operate system on chip, you will need 1.2V power supplies.On the SoC chip, there are 574 inputs available for use.99512 logic cells are present in logic system on chips.It has a 512KB flash.Searching M2S100 will yield system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.Based on the core architecture of ARM, the SoC meaning has a high level of performance.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S100-1FC1152 System On Chip (SoC) applications.

  • External USB hard disk/SSD
  • Efficient hardware for training of neural networks
  • Microprocessors
  • AC-input BLDC motor drive
  • Communication interfaces ( I2C, SPI )
  • Three phase UPS
  • Automotive gateway
  • Industrial automation devices
  • Microcontroller
  • Industrial sectors