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M2S150TS-1FCG1152I

-40°C~100°C TJ M2S150TS System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150TS-1FCG1152I
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 968
  • Description: -40°C~100°C TJ M2S150TS System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S150TS
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Manufacturer assigns package 1152-BBGA, FCBGA to this system on a chip.With 64KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.In addition, this SoC security combines FPGA - 150K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.574 I/Os in total are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.In the SoCs wireless, voltages above 1.26V are considered unsafe.If it has at least a 1.14V volt power supply, it can work fine.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip with 574 outputs is available.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip is equipped with 574 inputs for the user to choose from.146124 logic cells are present in logic system on chips.The flash is set to 512KB.M2S150TS will give you system on chips with similar specifications and purposes.A frequency of 166MHz is used by the wireless SoC to operate.Core architecture of ARM underpins the SoC meaning.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S150TS-1FCG1152I System On Chip (SoC) applications.

  • Industrial sectors
  • Optical drive
  • Networked Media Encode/Decode
  • Keywords
  • Communication interfaces ( I2C, SPI )
  • Personal Computers
  • Functional safety for critical applications in the industrial sectors
  • Efficient hardware for training of neural networks
  • Smartphone accessories
  • Robotics