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  • MC35FS4503NAER2

MC35FS4503NAER2

1V~5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC35FS4503NAER2
  • Package: 48-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 122
  • Description: 1V~5V Specialized Power Management ICs(Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~150°C TA
Packaging Tape & Reel (TR)
Series Automotive, AEC-Q100
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
RoHS Status ROHS3 Compliant

MC35FS4503NAER2 Overview


It is acceptable to ship in the way of Tape & Reel (TR) .A convenient transport package is provided in 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.The power management is intended for use at System Basis Chip as well as other applications.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~150°C TA .It works with 1V~5V voltage.The manage ics belongs to Automotive, AEC-Q100 series.

MC35FS4503NAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA

MC35FS4503NAER2 Applications


There are a lot of NXP USA Inc. MC35FS4503NAER2Power Management applications.

  • Projection Mapping
  • Docking station
  • Industrial Equipment
  • Set-Top-Box
  • Electronic Test Instrumentation
  • Networking Equipment
  • System Thermal for PCs
  • I/Os (FPGAs, ASICs, DSPs)
  • Camera Power Applications
  • Port/cable dongles