All Products

MC74ACT245DT

MC74ACT245DT datasheet pdf and Logic - Buffers, Drivers, Receivers, Transceivers product details from Rochester Electronics, LLC stock available at Utmel


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-MC74ACT245DT
  • Package: 20-TSSOP (0.173, 4.40mm Width)
  • Datasheet: PDF
  • Stock: 372
  • Description: MC74ACT245DT datasheet pdf and Logic - Buffers, Drivers, Receivers, Transceivers product details from Rochester Electronics, LLC stock available at Utmel(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tube
Series 74ACT
JESD-609 Code e4
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
Terminal Finish NICKEL PALLADIUM GOLD
Additional Feature WITH COMMON OUTPUT ENABLE AND DIRECTION CONTROL
Technology CMOS
Voltage - Supply 4.5V~5.5V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 5V
Terminal Pitch 0.65mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 20
JESD-30 Code R-PDSO-G20
Qualification Status Not Qualified
Output Type 3-State
Number of Elements 1
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4.5V
Number of Ports 2
Family ACT
Current - Output High, Low 24mA 24mA
Logic Type Transceiver, Non-Inverting
Output Polarity TRUE
Number of Bits per Element 8
Propagation Delay (tpd) 9 ns
Length 6.5mm
Width 4.4mm
RoHS Status ROHS3 Compliant

MC74ACT245DT Overview


Logical driver uses a neat 20-TSSOP (0.173, 4.40mm Width) package. Tube external packaging. Available in Surface Mount. Voltage buffer adopts Transceiver, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 4.5V~5.5V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 24mA 24mA. Logical driver can deal with 3-State output (s). All of the 1 elements are put into use. Digital buffer is one of the 74ACT series devices. 20 terminations with different functions. Buffer IC reuqires a supply voltage of 5V. Electronic parts from the ACT family are used in this part. 20 pins are set with the electric part. Enhanced with 2 ports. The bus transceiver employs 8 bits for each element. To supply the device, a minimum voltage of 4.5V is a must. Logical driver features WITH COMMON OUTPUT ENABLE AND DIRECTION CONTROL to better serve the need.

MC74ACT245DT Features


WITH COMMON OUTPUT ENABLE AND DIRECTION CONTROL

MC74ACT245DT Applications


There are a lot of Rochester Electronics, LLC MC74ACT245DT Buffers & Transceivers applications.

  • interconnection between switches
  • Fiber distributed data interface (FDDI)
  • SONET/SDH Network
  • Thermal management
  • Structural bonding
  • Switching system
  • Telecom and datacom networking applications
  • Metro access rings
  • Copper and fiber optic cables connection network
  • Relays