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MCIMX6DP7CVT8AB

0.8mm ARM? Cortex?-A9 Microprocessor i.MX6DP Series 624-FBGA, FCBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MCIMX6DP7CVT8AB
  • Package: 624-FBGA, FCBGA
  • Datasheet: PDF
  • Stock: 120
  • Description: 0.8mm ARM? Cortex?-A9 Microprocessor i.MX6DP Series 624-FBGA, FCBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Supply Voltage-Min (Vsup) 1.275V
Number of I/O 14
Speed 800MHz
Core Processor ARM® Cortex®-A9
Address Bus Width 26
Boundary Scan YES
External Data Bus Width 16
RAM (words) 512000
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, DDR3L, DDR3
USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Additional Interfaces CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Bus Compatibility CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB
Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
SATA SATA 3Gbps (1)
Height Seated (Max) 2.16mm
Length 21mm
RoHS Status ROHS3 Compliant
Factory Lead Time 15 Weeks
Package / Case 624-FBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Published 2002
Series i.MX6DP
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 624
ECCN Code 5A992
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B624
Supply Voltage-Max (Vsup) 1.5V

MCIMX6DP7CVT8AB Overview


Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. High reliability can be achieved by using the advanced packaging method Tray. Cores/Bus width is 2 Core 32-Bit. K-40°C~105°C TAw what the operating temperature is around -40°C~105°C TA. This is a member of the i.MX6DP series. With a core count of ARM? Cortex?-A9, this CPU is multicore. The CPU uses LPDDR2, DDR3L, DDR3 RAM controllers. A CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interface has been added to this microprocessor in order to serve the user better. In this CPU, I/O is set to 1.8V 2.5V 2.8V 3.3V. In total, there are 624 terminations. The maximum supply current of this microprocessor is 1.5V. Its external data bus width is 16. A CPU program transfers data by using 14 I/Os.

MCIMX6DP7CVT8AB Features


ARM? Cortex?-A9 Core
14 I/Os

MCIMX6DP7CVT8AB Applications


There are a lot of NXP USA Inc. MCIMX6DP7CVT8AB Microprocessor applications.

  • Answering machines
  • Printers
  • Electromechanical control
  • Network application field
  • Paper shredders
  • Fabric
  • Microwave ovens
  • Industrial control field
  • Industrial instrumentation devices
  • Hard drives