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MDT180M01001

MDT180M01001 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (Commercial Products) stock available at Utmel


  • Manufacturer: Amphenol ICC (Commercial Products)
  • Origchip NO: 44-MDT180M01001
  • Package: -
  • Datasheet: PDF
  • Stock: 835
  • Description: MDT180M01001 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (Commercial Products) stock available at Utmel(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Max Operating Temperature 80°C
Min Operating Temperature -40°C
Color Black
Number of Rows 2
Gender Female
Pitch 0.020 0.50mm
Contact Finish Gold
Read Out Dual
Contact Finish Thickness 30.0μin 0.76μm
RoHS Status RoHS Compliant
Factory Lead Time 9 Weeks
Contact Material Copper Alloy
Contact Plating Gold
Mount Surface Mount
Mounting Type Surface Mount, Right Angle
Number of Pins 67
Material - Insulation Liquid Crystal Polymer (LCP)
Operating Temperature -40°C~80°C
Packaging Tape & Reel (TR)
Series M.2
Feature Board Lock, Keyed
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 67

MDT180M01001 Overview


The material was packaged in accordance with Tape & Reel (TR)'s specifications.It's best to mount type Surface Mount, Right Angle.Features of the device are Board Lock, Keyed.M.2 tells you what series the device is.This allows stable operation up to 80°C°C.In order to ensure their reliability, they require a minimum working temperature of -40°C degrees Celsius.It needs 67 pins.

MDT180M01001 Features


M.2 series

MDT180M01001 Applications


There are a lot of Amphenol ICC (Commercial Products) MDT180M01001 Edgeboard Connectors applications.

  • Music reproduction technology
  • Micro and pico cell systems, software radios
  • Microcontrollers.
  • In-building wireless telephony
  • High Speed Data Acquisition
  • Communications
  • Digital signal processing
  • Data Acquisition Systems
  • 3-phase power control
  • GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,