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  • MPC8270VVUPEA

MPC8270VVUPEA

1.27mm PowerPC G2_LE 1.53.3V 32-bit Microprocessor MPC82xx Series MPC8270 1.5V 480-LBGA Exposed Pad


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MPC8270VVUPEA
  • Package: 480-LBGA Exposed Pad
  • Datasheet: PDF
  • Stock: 544
  • Description: 1.27mm PowerPC G2_LE 1.53.3V 32-bit Microprocessor MPC82xx Series MPC8270 1.5V 480-LBGA Exposed Pad (Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 18 Weeks
Package / Case 480-LBGA Exposed Pad
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Published 1997
Series MPC82xx
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 480
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Subcategory Other uPs/uCs/Peripheral ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC8270
JESD-30 Code S-PBGA-B480
Supply Voltage-Max (Vsup) 1.6V
Power Supplies 1.53.3V
Supply Voltage-Min (Vsup) 1.45V
Speed 450MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC G2_LE
Clock Frequency 100MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode NO
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10/100Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM, SDRAM
USB USB 2.0 (1)
Additional Interfaces I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP Communications; RISC CPM
Height Seated (Max) 1.65mm
Length 37.5mm
RoHS Status ROHS3 Compliant

MPC8270VVUPEA Description


Utilizing Our HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II processor MPC8270VVUPEA offers a range of performance, feature enhancements, and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and compelling, proven architecture.



MPC8270VVUPEA Features


603e core with 16K inst and 16K data caches

64-bit 60x bus, 32-bit PCI/local bus

128K ROM, 32K IRAM, 32K DPRAM

Three FCCs for 10/100 Ethernet

128 HDLC channels, 4 TDMs

4 SCCs, 2 SMCs, SPI, I2C

Memory controller built from SDRAM, UPM, and GPCM machines

New features -- USB, RMII



MPC8270VVUPEA Applications


Broadband Modem and Residential Gateway

Enterprise Access Point

Electricity Meter

Energy Gateway

Industrial Control

POS Terminal