All Products

MSC8122TMP4800V

0.8mm 1.13.3V CPLD 431 Pin 300MHz 1.1V FCBGA


  • Manufacturer: Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Origchip NO: 318-MSC8122TMP4800V
  • Package: FCBGA
  • Datasheet: PDF
  • Stock: 140
  • Description: 0.8mm 1.13.3V CPLD 431 Pin 300MHz 1.1V FCBGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
RAM Size 1.4MB
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Bit Size 16
Frequency (Max) 300MHz
Halogen Free Halogen Free
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
RAM (words) 735232
Barrel Shifter NO
Internal Bus Architecture MULTIPLE
Height Seated (Max) 3.3mm
Length 20mm
Width 20mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Contains Lead
Mount Surface Mount
Package / Case FCBGA
Number of Pins 431
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 431
ECCN Code 3A991
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Max Operating Temperature 105°C
Min Operating Temperature -40°C
HTS Code 8542.31.00.01
Subcategory Digital Signal Processors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.1V
Terminal Pitch 0.8mm
Frequency 300MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 431
Power Supplies 1.13.3V
Temperature Grade INDUSTRIAL
Interface Ethernet, RS-232
Max Supply Voltage 3.465V
Min Supply Voltage 1.07V

MSC8122TMP4800V Overview


An electronic component available in package FCBGA.In order to use it, it has 431 terminations.1.1V provides the supply voltage for it.There are 431 component pins.The configuration of the device includes 431 pins.To operate at 300MHz frequency, the device has a specific design.Surface Mount is the method of mounting it.The device can be classified as part of the Digital Signal Processors subcategory based on its specific characteristics.It is possible to supply as low a voltage as 1.07V to this device.3.465V is the maximum voltage that can be supplied to this device.Electricity is supplied by 1.13.3V.For its uPs/uCs/peripheral ICs, DIGITAL SIGNAL PROCESSOR, OTHER is used.Lower than 105°C should be the operating temperature.-40°C should be exceeded as the operating temperature.The maximum value of its frequency should be kept below 300MHz.

MSC8122TMP4800V Features


Supplied in the FCBGA package
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics

MSC8122TMP4800V Applications


There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors) MSC8122TMP4800V DSP applications.

  • Other sensor array processing
  • Processing system
  • Consumer electronic gadgets
  • Streaming music
  • Speech processing
  • Infrared
  • TVs
  • Scene analysis technology
  • 3D tomography and imaging processing
  • Radio detection and rangin systems