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PCX755CVZFU400LE

PowerPC Microprocessor PCX755 360-BBGA Exposed Pad


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-PCX755CVZFU400LE
  • Package: 360-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: 140
  • Description: PowerPC Microprocessor PCX755 360-BBGA Exposed Pad (Kg)

Purchase & Inquiry

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Purchase

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case 360-BBGA Exposed Pad
Supplier Device Package 360-PBGA (25x25)
Operating Temperature -40°C~110°C TJ
Packaging Tray
Published 2006
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PCX755
Speed 400MHz
Core Processor PowerPC
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RoHS Status Non-RoHS Compliant

PCX755CVZFU400LE Overview


Since the microprocessor is packed in 360-BBGA Exposed Pad, shipping overseas is convenient. High reliability is provided by the advanced packaging method Tray. Cores/Bus width is 1 Core 32-Bit. Understand the operating temperature around -40°C~110°C TJ. PowerPC processors are embedded in this CPU. 2.5V 3.3V is the CPU's I/O address. Use PCX755 when searching for variants of the embedded microprocessor. A supplier offers a 360-PBGA (25x25) package.

PCX755CVZFU400LE Features


PowerPC Core

PCX755CVZFU400LE Applications


There are a lot of Microchip Technology PCX755CVZFU400LE Microprocessor applications.

  • Office automation equipment and computer peripherals
  • Gas monitoring systems
  • Torpedo guidance
  • Network application field
  • DDC control
  • Heater/Fan
  • Dryers
  • Auto-breaking system
  • DCS control intelligent sensor
  • ECG machine