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SSTU32864EC,551

25, 14 Bit 1:1, 1:2 Configurable Registered Buffer 0°C~70°C Specialty Logic IC 74SSTU32864 0.8mm 1.7V~1.9V 96-LFBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-SSTU32864EC,551
  • Package: 96-LFBGA
  • Datasheet: PDF
  • Stock: 294
  • Description: 25, 14 Bit 1:1, 1:2 Configurable Registered Buffer 0°C~70°C Specialty Logic IC 74SSTU32864 0.8mm 1.7V~1.9V 96-LFBGA (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 96-LFBGA
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tray
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 96
Additional Feature 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1
Supply Voltage 1.7V~1.9V
Terminal Pitch 0.8mm
Base Part Number 74SSTU32864
Pin Count 96
JESD-30 Code R-PBGA-B96
Qualification Status Not Qualified
Number of Bits 25, 14
Logic Type 1:1, 1:2 Configurable Registered Buffer
Output Polarity TRUE
Trigger Type POSITIVE EDGE
Propagation Delay (tpd) 2 ns
fmax-Min 450 MHz
Source Url Status Check Date 2013-06-14 00:00:00
Height Seated (Max) 1.5mm
Length 13.5mm
Width 5.5mm
RoHS Status ROHS3 Compliant

SSTU32864EC,551 Overview


Using Tray as a packaging method is common.You can find it in package 96-LFBGA.It is essential that the device be able to operate normally by supplying a voltage of 1.7V~1.9V.Electronic parts mounted in the way of Surface Mount are referred to as this type.It is set to operate at a temperature of 0°C~70°C.For storing information, the memory is equipped with 25, 14 bits.Based on its base part number 74SSTU32864, related parts can be found.The number of all component pins adds up to 96.Signals are prevented from reflecting off the end of the transmission line through 96 terminations.A high level of performance is provided in 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE.

SSTU32864EC,551 Features



SSTU32864EC,551 Applications


There are a lot of NXP USA Inc. SSTU32864EC,551 Specialty Logic ICs applications.

  • Cell phones
  • Telecom and datacom networking applications
  • Broadcast application
  • Wireless interactive experience
  • Wired telephone
  • Cordless telephone
  • Data center
  • Low power, low voltage systems
  • Laser diode bonding
  • Digital systems