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SSTUH32865ET/G,518

28 Bit 1:2 Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTUH32865 0.65mm 1.7V~1.9V 160-TFBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-SSTUH32865ET/G,518
  • Package: 160-TFBGA
  • Datasheet: PDF
  • Stock: 820
  • Description: 28 Bit 1:2 Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTUH32865 0.65mm 1.7V~1.9V 160-TFBGA (Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 160-TFBGA
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tape & Reel (TR)
Published 2005
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 160
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.7V~1.9V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number 74SSTUH32865
Pin Count 160
JESD-30 Code R-PBGA-B160
Qualification Status Not Qualified
Number of Bits 28
Output Characteristics OPEN-DRAIN
Logic Type 1:2 Registered Buffer with Parity
Output Polarity COMPLEMENTARY
Trigger Type POSITIVE EDGE
Propagation Delay (tpd) 1.8 ns
fmax-Min 450 MHz
Height Seated (Max) 1.2mm
Length 13mm
Width 9mm
RoHS Status ROHS3 Compliant

SSTUH32865ET/G,518 Overview


Using Tape & Reel (TR) as a packaging method is common.You can find it in the 160-TFBGA package.In order for the device to perform properly, a voltage of 1.7V~1.9V is supplied.The Surface Mount way is used to mount electronic parts.It is set to operate at 0°C~70°C.Using the memory, information is stored in 28 bits.Parts related to the base part number 74SSTUH32865 can be found.There are 160 pins on all component boards.160 terminations reduce the likelihood of signals reflecting off the end of a transmission line.

SSTUH32865ET/G,518 Features



SSTUH32865ET/G,518 Applications


There are a lot of NXP USA Inc. SSTUH32865ET/G,518 Specialty Logic ICs applications.

  • VoIP phones
  • Sensor reporting
  • Fiber optic cable connection network
  • AV receiver
  • Wireless interactive experience
  • Fiber-to-the-desktop
  • Wireless modems
  • Remote controls
  • Precision geodetic measurement
  • Satellite ground stations and transmission stations