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TMS32C6416EZLZ7E3

CPLD TMS320C6414/15/16 Series 532-BFBGA, FCBGA


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-TMS32C6416EZLZ7E3
  • Package: 532-BFBGA, FCBGA
  • Datasheet: -
  • Stock: 778
  • Description: CPLD TMS320C6414/15/16 Series 532-BFBGA, FCBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 532-BFBGA, FCBGA
Supplier Device Package 532-FCBGA (23x23)
Operating Temperature 0°C~90°C TC
Packaging Tray
Series TMS320C6414/15/16
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Type Fixed Point
Interface Host Interface, McBSP, PCI, UTOPIA
Voltage - I/O 3.30V
Non-Volatile Memory External
Voltage - Core 1.40V
On Chip Data RAM 1.03MB
Clock Rate 720MHz
RoHS Status ROHS3 Compliant

TMS32C6416EZLZ7E3 Overview


It is a kind of electronic component available in the 532-BFBGA, FCBGA package.There is a packaging method of Tray provided with it.The Fixed Point family provides a wide range of applications.Surface Mount is mounted in a manner that allows it to be moved.It is recommended that the device operate at a temperature of 0°C~90°C TC to ensure its normal operation.The digital voltage range of 3.30V refers to the voltage that can be input or output.This digital signal processor is part of the TMS320C6414/15/16 series.

TMS32C6416EZLZ7E3 Features


Supplied in the 532-BFBGA, FCBGA package

TMS32C6416EZLZ7E3 Applications


There are a lot of Rochester Electronics, LLC TMS32C6416EZLZ7E3 DSP applications.

  • Control systems
  • 3D tomography and imaging processing
  • Financial signals
  • Instrument modeling
  • Medical imaging
  • Sonar
  • Automatic analysis system of EEG or ECG
  • Encoding/broadcast
  • Machinery and equipment
  • Audio synthesis