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XAZU2EG-1SFVA625Q

625 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XAZU2EG-1SFVA625Q
  • Package: 625-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 195
  • Description: 625 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 625-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 625
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B625
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.2MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Height Seated (Max) 3.43mm
Length 21mm
Width 21mm
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.There is a 625-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 1.2MB RAM implemented, this SoC chip provides users with a high level of performance.Internally, this SoC design uses the MPU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC EG series.This SoC meaning should have an average operating temperature of -40°C~125°C TJ when it is operating normally.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.128 I/Os are included in this SoC part.A 0.85V power supply should be used.In total, there are 625 terminations, which is great for system on a chip.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XAZU2EG-1SFVA625Q System On Chip (SoC) applications.

  • String inverter
  • Industrial AC-DC
  • RISC-V
  • Wireless sensor networks
  • Special Issue Editors
  • Deep learning hardware
  • Test and Measurement
  • Robotics
  • Healthcare
  • Temperature Sensors