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XAZU3EG-1SBVA484Q

484 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XAZU3EG-1SBVA484Q
  • Package: 484-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 667
  • Description: 484 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V (Kg)

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Details

Tags

Parameters
Factory Lead Time 6 Weeks
Package / Case 484-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Number of Terminations 484
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.8MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Height Seated (Max) 2.61mm
Length 19mm
Width 19mm
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A9 MPCore? with CoreSight?, Dual ARM? Cortex?-R5 MPCore? with CoreSight? core processor(s).


A core processor Quad ARM? Cortex?-A9 MPCore? with CoreSight?, Dual ARM? Cortex?-R5 MPCore? with CoreSight? is embedded in this SoC.It has been assigned a package 484-BFBGA, FCBGA by its manufacturer for this system on a chip.The 1.8MB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MPU, FPGA architecture for its internal architecture.It is a member of the Zynq? UltraScale+? MPSoC EG series.This SoC meaning should have an average operating temperature of -40°C~125°C TJ when it is operating normally.This SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells, an important feature to keep in mind.Tray package houses this SoC system on a chip.In total, this SoC part has 128 I/Os.Ideally, a power supply with a voltage of 0.85V should be used.As a result, there are 484 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.

Quad ARM? Cortex?-A9 MPCore? with CoreSight?, Dual ARM? Cortex?-R5 MPCore? with CoreSight? processor.


1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XAZU3EG-1SBVA484Q System On Chip (SoC) applications.

  • Microcontroller based SoC ( RISC-V, ARM)
  • Print Special Issue Flyer
  • Medical Pressure
  • Video Imaging
  • Communication interfaces ( I2C, SPI )
  • AC-input BLDC motor drive
  • Communication network-on-Chip (cNoC)
  • Robotics
  • Sensor network-on-chip (sNoC)
  • Personal Computers