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  • XAZU3EG-1SFVA625Q

XAZU3EG-1SFVA625Q

625 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XAZU3EG-1SFVA625Q
  • Package: 625-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 298
  • Description: 625 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 625-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 625
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B625
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.8MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Height Seated (Max) 3.43mm
Length 21mm
Width 21mm
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is embedded in this SoC.Its package is 625-BFBGA, FCBGA.A 1.8MB RAM SoC chip provides reliable performance to users.A MPU, FPGA technique is used for the SoC design's internal architecture.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.For this SoC meaning, the average operating temperature should be -40°C~125°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.Housed in the state-of-art Tray package.128 I/Os are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.85V.The system on a chip uses 625 terminations in total.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XAZU3EG-1SFVA625Q System On Chip (SoC) applications.

  • Special Issue Information
  • Smart appliances
  • Flow Sensors
  • Embedded systems
  • Automated sorting equipment
  • Microcontroller based SoC ( RISC-V, ARM)
  • Wireless networking
  • Smartphones
  • Industrial
  • ARM Cortex M4 microcontroller