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XC17S100AVOG8C

Surface Mount Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S100A


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S100AVOG8C
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 762
  • Description: Surface Mount Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S100A (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tray
Published 1999
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code 3A991.B.1
Voltage - Supply 3V~3.6V
Base Part Number XC17S100A
Pin Count 8
Operating Supply Voltage 3.3V
Programmable Type OTP
Density 1 Mb
Radiation Hardening No
RoHS Status RoHS Compliant

XC17S100AVOG8C Overview


FPGA uses a neat 8-SOIC (0.154, 3.90mm Width) package.External packaging of type Tray.Qualified to perform a variety of tasks within the 0°C~70°C environment.The OTP programming language can be used to program it.This device is fed with a voltage of 3V~3.6V which is applied to it.The memory device is mounted in Surface Mount.XC17S100A will give you other related parts.FPGA has pins on the 8 axis.As part of the package, the part comes with a set of 8 pins.Using 3.3V on the part before use will help the part run safely and reliably in a circuit.

XC17S100AVOG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.

XC17S100AVOG8C Applications


There are a lot of Xilinx Inc. XC17S100AVOG8C applications of configuration proms for FPGAs.

  • graphics card
  • eDRAM
  • personal computers
  • cell phones
  • printers
  • data buffer
  • eSRAM
  • workstations,
  • networks
  • embedded logic