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  • XC17S10XLVOG8C

XC17S10XLVOG8C

Surface Mount 100kb Mb Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S10XL


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S10XLVOG8C
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 684
  • Description: Surface Mount 100kb Mb Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S10XL (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tray
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S10XL
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 100kb
Operating Mode SYNCHRONOUS
Clock Frequency 10MHz
Supply Current-Max 0.005mA
Organization 95752X1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
Memory Density 95752 bit
I/O Type COMMON
Memory IC Type MEMORY CIRCUIT
Height Seated (Max) 1.2mm
Length 4.9mm
Width 3.9mm
RoHS Status RoHS Compliant

XC17S10XLVOG8C Overview


This package makes use of the 8-SOIC (0.154, 3.90mm Width) programming language.Packaging for Tray.As a qualified employee, I can operate within 0°C~70°C.With the help of OTP, it can be programmed.With a voltage of 3V~3.6V, it is powered.Surface Mount is the orientation of this memory device.A data storage size of 100kb is allowed.Try searching "XC17S10XL" for more parts.FPGA reuqires a supply voltage of 3.3V.Different functions are associated with 8 terminations.Using this memory device with a maximum voltage of 3.6V is possible.3V must be the minimum voltage supplied to the device.A MEMORY CIRCUIT memory chip like this is used for data storage.In reflow soldering procedure, the temperature should be controlled to no higher than 260.FPGA has pins on the 8 axis.The memory chip will not operate at a voltage above 0.005mA.Parts come with 8 pins set.When it comes to speed, this is a memory IC that can work at a frequency of 10MHz, which is very fast.In the memory, the I/O configuration has been set to COMMON.A power supply that is rated at 3.3V is recommended for use with this product.

XC17S10XLVOG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S10XLVOG8C Applications


There are a lot of Xilinx Inc. XC17S10XLVOG8C applications of configuration proms for FPGAs.

  • Cache memory
  • eDRAM
  • telecommunications
  • eSRAM
  • mainframes
  • workstations,
  • servers
  • DVD disk buffer
  • personal computers
  • printers