XC17S10XLVOG8I

XC17S10XLVOG8I Overview

The package uses a neat 8-SOIC (0.154, 3.90mm Width) interface.External packaging of type Tray.Qualified to operate within -40°C~85°C.Using OTP, you can program it.A voltage of 3V~3.6V is applied to it in order to power it.The memory device is mounted in Surface Mount.FPGA is limFPGAed to 100kb bytes for the size of the data storage.In addition to this part, you can search "XC17S10XL" for other similar parts.3.3V is the voltage it requires as a supply.There are different functions associated with 8 terminations.There is a maximum voltage of 3.6V that can be applied to this memory device.FPGA is imperative that the voltage of the device supply is at least 3V if the device is to work properly.A MEMORY CIRCUIT memory chip is shown here.Reflow soldering should be done at 260°C maximum.FPGA is equipped wFPGAh 8 pins.The memory chip will not operate at a voltage above 0.005mA.Parts come with 8 pins.FPGA is a 10MHz-frequency memory IC.As far as memory I/O is concerned, it is configured as COMMON.The use of a 3.3V power supply is recommended in order to achieve best results.

XC17S10XLVOG8I Features

Operating temperature: -40°C~85°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S10XLVOG8I Applications

There are a lot of Xilinx Inc. XC17S10XLVOG8I applications of configuration proms for FPGAs.

• personal digital assistants
• DVD disk buffer
• networks
• personal computers
• supercomputers
• Cache memory
• networking
• eDRAM
• nonvolatile BIOS memory
• cell phones