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  • XC17S30XLPDG8C

XC17S30XLPDG8C

Through Hole 300kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S30XL unknown


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S30XLPDG8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 704
  • Description: Through Hole 300kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S30XL unknown (Kg)

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Details

Tags

Parameters
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Interface Serial
Memory Size 300kb
Memory Type PROM
Operating Mode SYNCHRONOUS
Clock Frequency 10MHz
Supply Current-Max 0.005mA
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
I/O Type COMMON
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Termination Through Hole
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 250
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S30XL
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V

XC17S30XLPDG8C Overview


The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging for Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.OTP allows for programmability.With a voltage of 3V~3.6V, it is powered.Mounted in Through Hole is this memory device.The size of data storage is limited to 300kb.Look for "XC17S30XL" for other related parts.Supply voltage 3.3V is required.Different functions are associated with 8 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.It is necessary to supply the device with a minimum voltage of 3V.When soldering in reflow mode, the temperature should be kept below 250 at all times during the soldering process.Pins on it are 8-shaped.The memory chip is allowed to operate from a voltage no higher than 0.005mA.The part comes with a set of 8 pins.Speaking of speed, this is a memory IC that can work at a 10MHz frequency.There is a COMMON configuration for the memory's I/O.Memory is recommended to use a 3.3V power supply.The PROM memory is also referred to as the X memory.

XC17S30XLPDG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
COMMON I/O equipped.
PROM memory

XC17S30XLPDG8C Applications


There are a lot of Xilinx Inc. XC17S30XLPDG8C applications of configuration proms for FPGAs.

  • embedded logic
  • graphics card
  • personal digital assistants
  • personal computers
  • networking
  • mainframes
  • main computer memory
  • nonvolatile BIOS memory
  • data buffer
  • multimedia computers