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XC17S50AVOG8C

Surface Mount 500kb Mb Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S50A


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S50AVOG8C
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 287
  • Description: Surface Mount 500kb Mb Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S50A (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tray
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S50A
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 500kb
Supply Current-Max 0.015mA
Organization 559200X1
Output Characteristics 3-STATE
Memory Width 1
Density 1 Mb
Standby Current-Max 0.001A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 1.2mm
Length 4.9mm
Width 3.9mm
Radiation Hardening No
RoHS Status RoHS Compliant

XC17S50AVOG8C Overview


An interesting 8-SOIC (0.154, 3.90mm Width) package is used.External packaging for the Tray series.In the state of 0°C~70°C, licensed to work.With the help of OTP, it can be programmed.A voltage of 3V~3.6V is applied to it.Mounted in Surface Mount is this memory device.Data storage is limited to 500kb bytes.You can search "XC17S50A" for other related parts.There is a voltage requirement of 3.3V for supplying it with power.Various functions can be applied to 8 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.Minimum voltage 3V is required for the device to work.Using CONFIGURATION MEMORY memory chips, this is what you get.FPGA is recommended that the reflow soldering temperature be maintained at no more than 260 during the process.In this case, it has 8 pins.This memory transmit data in the SERIAL process way.The memory chip will not operate at a voltage above 0.015mA.There is a set of 8 pins included with the part.This memory has a COMMON configuration for its I/O.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.

XC17S50AVOG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S50AVOG8C Applications


There are a lot of Xilinx Inc. XC17S50AVOG8C applications of configuration proms for FPGAs.

  • embedded logic
  • eDRAM
  • servers
  • multimedia computers
  • cell phones
  • telecommunications
  • main computer memory
  • printers
  • networking
  • graphics card