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  • XC3S200-4FTG256I

XC3S200-4FTG256I

1.2V V 1.55mm mm FPGAs Spartan?-3 Series 256-LBGA 1mm mm 256


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC3S200-4FTG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 500
  • Description: 1.2V V 1.55mm mm FPGAs Spartan?-3 Series 256-LBGA 1mm mm 256 (Kg)

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Details

Tags

Parameters
Height Seated (Max) 1.55mm
Length 17mm
Width 17mm
RoHS Status ROHS3 Compliant
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2006
Series Spartan®-3
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3S200
Pin Count 256
Number of Outputs 173
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.32.5V
Number of I/O 173
RAM Size 27kB
Clock Frequency 630MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 4320
Total RAM Bits 221184
Number of Gates 200000
Number of LABs/CLBs 480
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.61 ns
Number of CLBs 480

XC3S200-4FTG256I Overview


A 256-LBGA package is provided with this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. The I/Os are designed to facilitate a more coherent transfer of data. There are 4320 logic elements/cells to form a fundamental building block. An electrical supply voltage of 1.2V powers it. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 1.14V~1.26V . The Spartan?-3 Series is one of the types of FPGAs that belong to this type. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. A device such as this one has 173 outputs built into it. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is designed wFpga chipsh 256 terminations. The RAM bits that are offered by this fpga chips are 221184. Its base part number XC3S200 can be used to find parts that are related to it. It is crucial that the RAM si27kBe of this FPGA module reaches 27kB so that the program can run normally. It has a total of 256 pins that are designed for it. 480 LABs/CLBs are integrated into this FPGA. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. The device runs on a 1.21.2/3.32.5V battery and requires no additional power supply to operate. Its basic building block contains 200000 gates. Fpga semiconductor is equipped wfpga semiconductorh 256 pin count. Normally, fpga semiconductor uses an oscillator, which oscillates at 630MHz, to create the signal. In order to make the architecture work, 480 CLBs are used.

XC3S200-4FTG256I Features


173 I/Os
Up to 221184 RAM bits
256 LABs/CLBs

XC3S200-4FTG256I Applications


There are a lot of Xilinx Inc. XC3S200-4FTG256I FPGAs applications.

  • Wireless Communications
  • DO-254
  • Industrial Ethernet
  • Solar Energy
  • Automation
  • Industrial,Medical and Scientific Instruments
  • Broadcast
  • Bioinformatics
  • Medical ultrasounds
  • High Performance Computing