XC3S200A-4FTG256C

XC3S200A-4FTG256C Overview

Fpga chips is supplied in the 256-LBGA package. The device has 195 I/O ports for more coherent data transfer. A fundamental building block is made up of 4032 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. This FPGA module can be attached to the development board with a Surface Mount. In order for it to operate, the supply voltage must be 1.14V~1.26V . As part of the Spartan?-3A series of FPGAs, it is a type of FPGA. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. With this device, you will be able to make use of 160 outputs. In order to save space, this FPGA model has been contained in Tray. As a whole, it has 256 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 294912 bFpga chipss. In order to find related parts, you can use its base part number XC3S200A. Fpga electronics is important that this FPGA module has a RAM si288kBe of 288kB in order to ensure that the program will run normally. Fpga electronics is designed wfpga electronics h 256 pins. An array of 448 LABs/CLBs is built into the FPGA. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. The device runs on a 1.22.5/3.3V battery and requires no additional power supply to operate. 200000 gates make up the basic block of its construction. In addition to this, it has 256 pins. A crystal oscillating at 667MHz is one of the most common components of this device. Its architecture is based on 448 CLBs. In the RAM memory, data is stored safely and resource conflicts are avoided.

XC3S200A-4FTG256C Features

195 I/Os
Up to 294912 RAM bits
256 LABs/CLBs

XC3S200A-4FTG256C Applications

There are a lot of Xilinx Inc. XC3S200A-4FTG256C FPGAs applications.

• Data Center
• Medical Electronics
• Military DSP
• Filtering and communication encoding
• Data Mining
• Data center hardware accelerators
• Solar Energy
• Radar and Sensors
• Enterprise networking
• Industrial IoT