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XC7Z035-1FFG676C

676 Terminations0°C~85°C TJ System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z035-1FFG676C
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 783
  • Description: 676 Terminations0°C~85°C TJ System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.37mm
Length 27mm
Width 27mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 275K Logic Cells.Tray package houses this SoC system on a chip.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.05V.There is a possibility that it can be powered by a power supply of at least 0.95V.In total, there are 676 terminations, which is great for system on a chip.667MHz is the wireless SoC's frequency.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z035-1FFG676C System On Chip (SoC) applications.

  • Servo drive control module
  • Fitness
  • Efficient hardware for training of neural networks
  • Self-aware system-on-chip (SoC)
  • Apple smart watch
  • Automotive gateway
  • Remote control
  • RISC-V
  • CNC control
  • Mouse