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XC7Z035-3FFG900E

900 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z035-3FFG900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 199
  • Description: 900 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 90 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
Speed Grade 3
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Number of Registers 343800
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Zynq?-7000 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.This SoC security combines Kintex?-7 FPGA, 275K Logic Cells, an important feature to keep in mind.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.Use a power supply with a voltage of 1V if possible.In total, there are 900 terminations, so system on a chip is really aided by this.A frequency of 800MHz is used by the wireless SoC to operate.Core architecture of ARM underpins the SoC meaning.It is rated with 1.05V maximum supply voltage.As long as it receives at least 950mV of power, then it is working.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z035-3FFG900E System On Chip (SoC) applications.

  • String inverter
  • Industrial transport
  • Wireless networking
  • ARM processors
  • Microcontroller based SoC ( RISC-V, ARM)
  • Apple smart watch
  • Deep learning hardware
  • ARM support modules
  • Industrial Pressure
  • DC-input BLDC motor drive