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XC7Z045-L2FBG676I

676 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z045-L2FBG676I
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 642
  • Description: 676 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 2.54mm
Length 27mm
Width 27mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.This SoC design employs the MCU, FPGA technique for its internal architecture.In the Zynq?-7000 series, this system on chip SoC is included.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 130 I/Os in total.Use a power supply with a voltage of 1V if possible.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.In order to run it, it must be fed by at least 0.95V of power.As a result, there are 676 terminations in total, which does really benefit system on a chip.At 800MHz, the wireless SoC works.Core architecture of ARM underpins the SoC meaning.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z045-L2FBG676I System On Chip (SoC) applications.

  • Level
  • Self-aware system-on-chip (SoC)
  • Deep learning hardware
  • AC-input BLDC motor drive
  • Embedded systems
  • Central alarm system
  • Robotics
  • Mobile market
  • Remote control
  • Optical drive