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XCR3256XL-10PQG208I

PMIC CoolRunner XPLA3 Series 208 Pin 208-BFQFP


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCR3256XL-10PQG208I
  • Package: 208-BFQFP
  • Datasheet: PDF
  • Stock: 120
  • Description: PMIC CoolRunner XPLA3 Series 208 Pin 208-BFQFP (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 208-BFQFP
Number of Pins 208
Supplier Device Package 208-PQFP (28x28)
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2003
Series CoolRunner XPLA3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Operating Supply Voltage 3.3V
Programmable Type In System Programmable (min 1K program/erase cycles)
Number of I/O 164
Memory Type EEPROM
Propagation Delay 10 ns
Number of Logic Elements/Cells 16
Number of Gates 6000
Max Frequency 105MHz
Number of Logic Blocks (LABs) 16
Speed Grade 10
Number of Macro Cells 256
Voltage Supply - Internal 2.7V~3.6V
Delay Time tpd(1) Max 9.1ns
Number of Logic Elements/Blocks 16
RoHS Status ROHS3 Compliant

XCR3256XL-10PQG208I Overview


There are 256 macro cells. A macro cell is a cell in a mobile phone network that provides radio coverage through the use of a high-power cell site (tower, antenna or mast).You can find it in package [0].There are 164 I/Os on the board.Ideally, the chip should be packaged by Tray.During operation, the operating temperature is kept at -40°C~85°C TA to ensure its reliability.Chips should be mounted by Surface Mount.The CoolRunner XPLA3series comprises this type of FPGA.For digital circuits, there are 6000gates. These devices serve as building blocks.High efficiency requires a voltage supply of [0].It is adopted to store data in [0].In this case, it is mounted by Surface Mount.It is designed with 208 pins.16logic blocks/elements are present.Ideally, the maximal frequency should be lower than 105MHz Hz.It is recommended that the operating temperature be greater than -40°C.Temperatures should be lower than 85°C when operating.Its basic building block is composed of 16 logic blocks (LABs).Fundamental building blocks consist of 16logic elements/cells.

XCR3256XL-10PQG208I Features


208-BFQFP package
164 I/Os
The operating temperature of -40°C~85°C TA
208 pins
16 logic blocks (LABs)

XCR3256XL-10PQG208I Applications


There are a lot of Xilinx Inc. XCR3256XL-10PQG208I CPLDs applications.

  • SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
  • Software Configuration of Add-In Boards
  • Cross-Matrix Switch
  • Portable digital devices
  • Field programmable gate
  • Discrete logic functions
  • Bootloaders for FPGAs
  • Programmable polarity
  • Complex programmable logic devices
  • High speed graphics processing