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  • XCR3512XL-10FGG324C

XCR3512XL-10FGG324C

1mm PMIC 324 Pin 3.3V FBGA


  • Manufacturer: Xilinx
  • Origchip NO: 903-XCR3512XL-10FGG324C
  • Package: FBGA
  • Datasheet: PDF
  • Stock: 294
  • Description: 1mm PMIC 324 Pin 3.3V FBGA (Kg)

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Details

Tags

Parameters
Factory Lead Time 6 Weeks
Mount Surface Mount
Package / Case FBGA
Number of Pins 324
Published 1996
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 324
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 324
Qualification Status Not Qualified
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Temperature Grade COMMERCIAL
Number of I/O 260
Memory Type EEPROM
Propagation Delay 10 ns
Frequency (Max) 97MHz
Programmable Logic Type EE PLD
Number of Gates 12000
Number of Logic Blocks (LABs) 32
Speed Grade 10
Output Function MACROCELL
Number of Macro Cells 512
JTAG BST YES
In-System Programmable YES
Height Seated (Max) 2.5mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

XCR3512XL-10FGG324C Overview


The mobile phone network has 512 macro cells, which are cells that provide radio coverage from high-power cell sites (towers, antennas, or masts).It is part of the FBGA package.There are 260 I/Os on the board.324terminations have been programmed into the device.Its terminal position is BOTTOM.The device is powered by a voltage of 3.3V volts.It is a part of family [0].There are 324pins on the chip.It is also possible to find YESwhen using this device.In digital circuits, there are 12000gates, which act as a basic building block.In order to maintain high efficiency, the supply voltage should be maintained at [0].In general, it is recommended to store data in [0].The electronic part is mounted by Surface Mount.There are 324 pins on the device.3.6Vis the maximum supply voltage (Vsup).Operating temperatures should be higher than 0°C.There should be a temperature below 70°Cat the time of operation.32logic blocks (LABs) make up this circuit.There should be a lower maximum frequency than 97MHz.There are several types of programmable logic that can be categorized as EE PLD.

XCR3512XL-10FGG324C Features


FBGA package
260 I/Os
324 pin count
324 pins
32 logic blocks (LABs)

XCR3512XL-10FGG324C Applications


There are a lot of Xilinx XCR3512XL-10FGG324C CPLDs applications.

  • I/O expansion
  • Synchronous or asynchronous mode
  • Power up sequencing
  • ToR/Aggregation/Core Switch and Router
  • Custom state machines
  • Wide Vin Industrial low power SMPS
  • Storage Cards and Storage Racks
  • LED Lighting systems
  • INTERRUPT SYSTEM
  • Cross-Matrix Switch