All Products

XCV812E-6BG560C

1.8V V 1.7mm mm FPGAs Virtex?-E EM Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCV812E-6BG560C
  • Package: 560-LBGA Exposed Pad, Metal
  • Datasheet: PDF
  • Stock: 816
  • Description: 1.8V V 1.7mm mm FPGAs Virtex?-E EM Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560 (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 560-LBGA Exposed Pad, Metal
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2002
Series Virtex®-E EM
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 560
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCV812E
Pin Count 560
Number of Outputs 404
Operating Supply Voltage 1.8V
Number of I/O 404
RAM Size 140kB
Clock Frequency 357MHz
Number of Inputs 404
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 21168
Total RAM Bits 1146880
Number of Gates 254016
Number of LABs/CLBs 4704
Speed Grade 6
Combinatorial Delay of a CLB-Max 0.47 ns
Height Seated (Max) 1.7mm
Length 42.5mm
Width 42.5mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XCV812E-6BG560C Overview


Fpga chips is supplied in the 560-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 404 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 21168 logic elements/cells. Supply voltage is 1.8V volts. The Field Programmable Gate Arrays family of FPGA parts includes this part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. The supply voltage of the device is 1.71V~1.89V , at which it runs. It is a type of FPGA belonging to the Virtex?-E EM seies. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. With this device, you will be able to make use of 404 outputs. As a result of space limitations, this FPGA model has been included in Tray. Total terminations are 560. The RAM bits that this device offer is 1146880. Its base part number XCV812E can be used to find related parts. For the program to work properly, the RAM si140kBe of this FPGA module must reach 140kB GB in order to ensure normal operation. Fpga electronics contains 4704 LABs/CLBs in an array. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. A 1.8V-volt supply allows designers to fully utilize its flexibility. The basic building block of this system consists of 254016 gates. There are a total of 560 pins on this device. It usually uses a crystal oscillating at a frequency of 357MHz in order to do its work.

XCV812E-6BG560C Features


404 I/Os
Up to 1146880 RAM bits

XCV812E-6BG560C Applications


There are a lot of Xilinx Inc. XCV812E-6BG560C FPGAs applications.

  • Electronic Warfare
  • Medical imaging
  • Military Temperature
  • Artificial intelligence (AI)
  • Audio
  • Medical Applications
  • Solar Energy
  • Radar and Sensors
  • Digital signal processing
  • Ecosystem