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XCZU17EG-1FFVC1760I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU17EG-1FFVC1760I
Package: 1760-BBGA, FCBGA
Datasheet: PDF
Stock: 793
Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	1760-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	512
Speed	500MHz, 600MHz, 1.2GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

A core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is integrated into this SoC.Its package is 1760-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 512 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.

256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.

XCZU17EG-1FFVC1760I System On Chip (SoC) applications.

Self-aware system-on-chip (SoC)
Level
Smart appliances
Mobile computing
Communication interfaces ( I2C, SPI )
Smart appliances
Body control module
Smartphones
Wireless sensor networks
Deep learning hardware