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XCZU2CG-2SFVA625I

625 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU2CG-2SFVA625I
  • Package: 625-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 536
  • Description: 625 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O0.85V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 625-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 625
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B625
Supply Voltage-Max (Vsup) 0.876V
Supply Voltage-Min (Vsup) 0.825V
Number of I/O 180
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC has been developed.It has been assigned a package 625-BFBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series Zynq? UltraScale+? MPSoC CG.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells and that is something to note.An advanced Tray package houses this SoC system on a chip.This SoC part has a total of 180 I/Os.A power supply with a 0.85V rating is recommended.The SoCs wireless cannot operate at a voltage greater than 0.876V because it is considered unsafe for the application.This SoC system on a chip can run on a power supply that is at least 0.825V.In total, there are 625 terminations, which makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XCZU2CG-2SFVA625I System On Chip (SoC) applications.

  • Smartphones
  • Functional safety for critical applications in the industrial sectors
  • Measurement testers
  • Flow Sensors
  • Industrial Pressure
  • Multiprocessor system-on-chips (MPSoCs)
  • Cyberphysical system-on-chip
  • High-end PLC
  • Measurement tools
  • Fitness