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XRT75L03DIV-F

Telecom device3 Circuits


  • Manufacturer: MaxLinear, Inc.
  • Origchip NO: 493-XRT75L03DIV-F
  • Package: 128-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 281
  • Description: Telecom device3 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 128-LQFP Exposed Pad
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 3
Current - Supply 480mA

XRT75L03DIV-F Overview


In order to save space on the board, 128-LQFP Exposed Pad packages are used.For packing, Tray is used.Surface Mount is used as telecommunications equipment mounting type.A 3 circuit is the heart of this telecom IC .When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.There is a supply current of 480mA for telecom equipment to operate on.

XRT75L03DIV-F Features


Available in the 128-LQFP Exposed Pad package

XRT75L03DIV-F Applications


There are a lot of MaxLinear, Inc. XRT75L03DIV-F Telecom applications.

  • T3 channelized access concentrators
  • PCM channel bank
  • Channel Banks
  • Routers
  • T1/E1/J1 add/drop multiplexers (MUX)
  • E1 Multiplexer
  • Multi-Line E1 Interface Cards
  • Microwave transmission systems
  • ISDN Primary Rate Interface
  • ISDN Primary Rate Interfaces (PRA)