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XRT75R06IB-F

Telecom device6 Circuits


  • Manufacturer: MaxLinear, Inc.
  • Origchip NO: 493-XRT75R06IB-F
  • Package: 217-BBGA
  • Datasheet: PDF
  • Stock: 350
  • Description: Telecom device6 Circuits(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Current - Supply 725mA
Mounting Type Surface Mount
Package / Case 217-BBGA
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 6

XRT75R06IB-F Overview


Space is saved on the board by using the 217-BBGA package.Telecommunications equipment is packed using the Tray method.A Surface Mount-mount is used for mounting the telecom circuit.6 circuits make up this telecom IC .Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.Operating temperatures of -40°C~85°C can ensure reliable performance.A 725mA supply current is required to operate telecom equipment .

XRT75R06IB-F Features


Available in the 217-BBGA package

XRT75R06IB-F Applications


There are a lot of MaxLinear, Inc. XRT75R06IB-F Telecom applications.

  • Central office
  • Cable PC
  • Routers
  • T3 channelized access concentrators
  • SDH Multiplexers
  • ISDN Primary Rate Interface
  • Channel Banks
  • High speed data transmission line cards
  • Wireless base stations
  • High-Density T1/E1/J1 interfaces for Multiplexers