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Connectors
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Discrete Semiconductors
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Capacitors
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Sensors
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- Ultrasonic Receivers
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- Resistors
- Isolators
- Board Mount Poser Supplies
-
RF/IF & RFID
- RF/IF & RFID
- Attenuators
- Balun
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- RF Amplifiers
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- RF Boards
- RF Demodulators
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- RF Misc ICs and Modules
- RF Mixers
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- RFI & EMI Contacts
- RFI & EMI Materials
- RFID Accessories
- RFID Antennas
- RFID Boards
- RFID ICs
- RFID Reader Modules
- RFID Tags
- Circuit Protection
- Crystals
- Inductors
- Filters
Thermal Management
Img
|
Part Number |
Manufacturers
|
Desc
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In Stock
|
Packing
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Rfq |
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t-Global Technology |
HIGH PERFORMANCE SILICONE GAP FI
|
847 |
- |
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Laird Technologies - Thermal Materials |
Thermal Interface Products Tflex HR6130 9x9" 3.0W/mK gap filler
|
758 |
- |
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Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM PINK
|
393 |
- |
|
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Bergquist |
THERM PAD 304.80MMX254MM WHITE
|
492 |
015 |
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3M (TC) |
THERMAL INTERFACE PAD 50MM
|
278 |
- |
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t-Global Technology |
THERM PAD 24MMX21.01MM WHITE
|
717 |
- |
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Panasonic Electronic Components |
THERM PAD 230MMX180MM GRAY
|
197 |
- |
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3M (TC) |
THERM PAD 457.2MMX355.6MM 2/PK
|
505 |
- |
|
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3M |
THERM PAD 32.92MX25.4MM W/ADH
|
464 |
- |
|
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|
|
Laird Technologies - Thermal Materials |
Thermal Interface Products Tflex 6140 DC1 9x9" 3.0W/mK gap filler
|
235 |
- |
|
||||||||||||||||||||||||
|
|
Laird Technologies - Thermal Materials |
Thermal Interface Products Tflex 6200 9x9" 3.0W/mK gap filler
|
760 |
- |
|
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|
|
3M (TC) |
THERM PAD 4.57MX76.2MM W/ADH WHT
|
894 |
- |
|
||||||||||||||||||||||||
|
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GRAY
|
857 |
- |
|
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|
|
Bergquist |
Thermal Interface Products 8X16 .125 LT YLW GAP PAD 2500S20
|
435 |
125 |
|
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Keystone Electronics |
Mounting Hardware MICA INSULATOR TO-3
|
852 |
TO-3 |
|
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Laird Technologies - Thermal Materials |
Thermal Interface Products Tgard 220,A1 16" x 16"
|
793 |
- |
|
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|
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GRAY
|
280 |
- |
|
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|
|
Wakefield-Vette |
CD-02-05 Series 0.95 x 0.75 inch no Hole TO-247 Phase Change Thermal Pad
|
723 |
- |
|
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t-Global Technology |
THERM PAD 19.05MMX12.7MM W/ADH
|
628 |
TO-220 |
|
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Keystone Electronics |
INSULATOR MICA 1.080X.575"D PLAS
|
195 |
- |
|
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t-Global Technology |
THERM PAD 150MMX150MM W/ADH RED
|
206 |
- |
|
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|
|
Bergquist |
THERM PAD 45.21MMX31.75MM PINK
|
344 |
TO-3 |
|
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|
|
Laird Technologies - Thermal Materials |
THERM PAD 25.4MMX19.05MM WHITE
|
104 |
- |
|
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|
|
Parker Chomerics |
CHO-THERM 1674 TO-220 0.010"
|
658 |
- |
|
||||||||||||||||||||||||
|
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6X228.6MM BLU/VIO
|
320 |
- |
|
||||||||||||||||||||||||
|
|
Laird Technologies - Thermal Materials |
Thermal Interface Products Tpli 2120 A0 8x8" 6 W/mK gap filler
|
130 |
- |
|
||||||||||||||||||||||||
|
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GRAY
|
404 |
- |
|
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|
|
t-Global Technology |
THERM PAD 20MMX20MM GRAY
|
528 |
- |
|
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|
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GREEN
|
545 |
- |
|
||||||||||||||||||||||||
|
|
Laird Technologies - Thermal Materials |
THERM PAD 19.05MMX12.7MM GRAY
|
497 |
TO-220 |
|
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