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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Microsemi Corporation
-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 267 I/O
512
484-BGA
Xilinx Inc.
484 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 82 I/O0.72V
325
484-BFBGA, FCBGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
889
484-BGA
Microsemi Corporation
536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
267
536-LFBGA, CSPBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ M2S090TS System On ChipSmartFusion?2 Series 267 I/O1.2V
699
484-BGA
Microsemi Corporation
536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
795
536-LFBGA, CSPBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
444
484-BFBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
941
484-BGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ M2S090T System On ChipSmartFusion?2 Series 425 I/O1.2V
113
676-BGA
Microsemi Corporation
-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 267 I/O
977
484-BGA
Microsemi Corporation
896 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V
157
896-BGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
206
484-BFBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ 484 Pin M2S090 System On ChipSmartFusion?2 Series 267 I/O1.2V
578
484-BGA
Xilinx Inc.
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 82 I/O
463
484-BFBGA, FCBGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
467
325-TFBGA, CSPBGA
Xilinx Inc.
625 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O0.72V
915
625-BFBGA, FCBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
757
484-BFBGA
Microsemi Corporation
536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
528
536-LFBGA, CSPBGA
Microsemi Corporation
676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V
624
676-BGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
535
484-BGA
Microsemi Corporation
-40°C~100°C TJ M2S150 System On ChipSmartFusion?2 Series 574 I/O
235
1152-BBGA, FCBGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
906
676-BGA
Microsemi Corporation
536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
512
536-LFBGA, CSPBGA
Microsemi Corporation
0°C~85°C TJ 1152 Pin M2S150T System On ChipSmartFusion?2 Series 574 I/O1.2V Min 1.14V VMax 1.26V V
654
1152-BBGA, FCBGA
Xilinx Inc.
484 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V
230
484-BBGA, FCBGA
Xilinx Inc.
-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 82 I/O
888
484-BFBGA, FCBGA
Microsemi Corporation
536 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
951
536-LFBGA, CSPBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
695
484-BFBGA
Xilinx Inc.
-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 180 I/O
934
625-BFBGA, FCBGA
Xilinx Inc.
625 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.72V
324
625-BFBGA, FCBGA