All Products

SoC

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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Microsemi Corporation
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
973
676-BGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
120
484-BGA
Microsemi Corporation
0°C~85°C TJ System On ChipSmartFusion?2 Series 377 I/O
721
896-BGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
278
325-TFBGA, CSPBGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
929
325-TFBGA, CSPBGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ 325 Pin System On ChipSmartFusion?2 Series 180 I/O1.2V
361
325-TFBGA, CSPBGA
Xilinx Inc.
485 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V
298
484-LFBGA, CSPBGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
864
325-TFBGA, CSPBGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
627
325-TFBGA, CSPBGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
351
325-TFBGA, CSPBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
127
484-BGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
482
325-TFBGA, CSPBGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
341
484-BGA
Microsemi Corporation
484 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
341
484-BGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
712
484-BGA
Microsemi Corporation
-40°C~100°C TJ 896 Pin M2S050T System On ChipSmartFusion?2 Series 377 I/OMin 1.14V VMax 1.26V V
987
896-BGA
Microsemi Corporation
676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
243
676-BGA
Microsemi Corporation
484 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
211
484-BGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
664
484-BGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
465
484-BGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
527
484-BFBGA
Xilinx Inc.
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O
323
625-BFBGA, FCBGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
411
676-BGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
326
484-BGA
Microsemi Corporation
536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
795
536-LFBGA, CSPBGA
Xilinx Inc.
-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O
875
625-BFBGA, FCBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
167
484-BFBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
115
484-BFBGA
Microsemi Corporation
676 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 425 I/O1.2V
158
676-BGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V
728
676-BGA