Products
Img
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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Rfq |
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Microsemi Corporation |
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
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973 |
676-BGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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120 |
484-BGA |
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Microsemi Corporation |
0°C~85°C TJ System On ChipSmartFusion?2 Series 377 I/O
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721 |
896-BGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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278 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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929 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ 325 Pin System On ChipSmartFusion?2 Series 180 I/O1.2V
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361 |
325-TFBGA, CSPBGA |
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Xilinx Inc. |
485 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V
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298 |
484-LFBGA, CSPBGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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864 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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627 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
|
351 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
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127 |
484-BGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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482 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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341 |
484-BGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
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341 |
484-BGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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712 |
484-BGA |
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Microsemi Corporation |
-40°C~100°C TJ 896 Pin M2S050T System On ChipSmartFusion?2 Series 377 I/OMin 1.14V VMax 1.26V V
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987 |
896-BGA |
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Microsemi Corporation |
676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
|
243 |
676-BGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
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211 |
484-BGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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664 |
484-BGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
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465 |
484-BGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
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527 |
484-BFBGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O
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323 |
625-BFBGA, FCBGA |
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Microsemi Corporation |
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
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411 |
676-BGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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326 |
484-BGA |
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Microsemi Corporation |
536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
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795 |
536-LFBGA, CSPBGA |
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Xilinx Inc. |
-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O
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875 |
625-BFBGA, FCBGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
|
167 |
484-BFBGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
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115 |
484-BFBGA |
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Microsemi Corporation |
676 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 425 I/O1.2V
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158 |
676-BGA |
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Microsemi Corporation |
676 Terminations-40°C~100°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V
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728 |
676-BGA |
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Products