Products
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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Microsemi Corporation |
-40°C~100°C TJ M2S025S System On ChipSmartFusion?2 Series 267 I/O
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911 |
484-BGA |
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Microsemi Corporation |
-40°C~100°C TJ M2S050S System On ChipSmartFusion?2 Series 377 I/O
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109 |
896-BGA |
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Microsemi Corporation |
-40°C~100°C TJ 400 Pin M2S050S System On ChipSmartFusion?2 Series 207 I/O
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570 |
400-LFBGA |
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Xilinx Inc. |
0°C~85°C TJ XC7Z020 System On ChipZynq?-7000 Series 130 I/O
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526 |
400-LFBGA, CSPBGA |
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Microsemi Corporation |
0°C~85°C TJ 144 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 21, FPGA - 33 I/OMin 1.425V VMax 1.575V V
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615 |
144-LQFP |
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Microsemi Corporation |
-40°C~100°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 21, FPGA - 33 I/O
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520 |
144-LQFP |
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Microsemi Corporation |
-40°C~100°C TJ M2S025S System On ChipSmartFusion?2 Series 267 I/O
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654 |
484-BGA |
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Microsemi Corporation |
0°C~85°C TJ M2S100T System On ChipSmartFusion?2 Series 574 I/O1.2V
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769 |
1152-BBGA, FCBGA |
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Microsemi Corporation |
-40°C~100°C TJ M2S090S System On ChipSmartFusion?2 Series 425 I/O
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895 |
676-BGA |
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Microsemi Corporation |
-40°C~100°C TJ 400 Pin M2S025S System On ChipSmartFusion?2 Series 207 I/O
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436 |
400-LFBGA |
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Microsemi Corporation |
-55°C~125°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O
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688 |
256-LBGA |
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Intel |
-40°C~100°C TJ System On ChipStratix? 10 SX Series
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233 |
1760-BBGA, FCBGA |
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Microsemi Corporation |
-40°C~100°C TJ 1152 Pin M2S100S System On ChipSmartFusion?2 Series 574 I/OMin 1.14V VMax 1.26V V
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836 |
1152-BBGA, FCBGA |
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Microsemi Corporation |
-40°C~100°C TJ M2S050S System On ChipSmartFusion?2 Series 267 I/O
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464 |
484-BGA |
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Microsemi Corporation |
-40°C~100°C TJ 208 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/OMin 1.425V VMax 1.575V V
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643 |
208-BFQFP |
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Intel |
-40°C~100°C TJ System On ChipStratix? 10 SX Series 688 I/O
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483 |
1760-BBGA, FCBGA |
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Intel |
0°C~100°C TJ System On ChipStratix? 10 SX Series
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162 |
2912-BBGA, FCBGA |
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Microsemi Corporation |
-40°C~100°C TJ M2S090S System On ChipSmartFusion?2 Series 425 I/O
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226 |
676-BGA |
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V
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437 |
256-LBGA |
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Xilinx Inc. |
484 Terminations-40°C~100°C TJ System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O
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641 |
484-BBGA, FCBGA |
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Microsemi Corporation |
144 Terminations-40°C~100°C TJ 144 Pin System On ChipSmartFusion?2 Series 84 I/O1.2V
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640 |
144-LQFP |
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Broadcom Limited |
System On Chip
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656 |
- |
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Broadcom Limited |
System On Chip
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385 |
- |
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Microsemi Corporation |
-55°C~125°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V
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758 |
1152-BBGA, FCBGA |
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Microsemi Corporation |
144 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
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945 |
144-LQFP |
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Broadcom Limited |
System On Chip
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508 |
- |
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Xilinx Inc. |
784 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O0.9V
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605 |
784-BFBGA, FCBGA |
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Broadcom Limited |
System On Chip
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347 |
- |
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Broadcom Limited |
System On Chip
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675 |
- |
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Microsemi Corporation |
144 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
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862 |
144-LQFP |
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