Img
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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Rfq |
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Xilinx Inc. |
676 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 4 I/O
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839 |
676-BBGA, FCBGA |
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Microsemi Corporation |
676 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V
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109 |
676-BGA |
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Xilinx Inc. |
485 Terminations0°C~100°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V
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444 |
484-LFBGA, CSPBGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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510 |
484-BGA |
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Xilinx Inc. |
484 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V
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738 |
484-LFBGA, CSPBGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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293 |
484-BGA |
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Microsemi Corporation |
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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727 |
484-BGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
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559 |
484-BGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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657 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
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302 |
676-BGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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250 |
484-BGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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651 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
-40°C~100°C TJ 400 Pin M2S050TS System On ChipSmartFusion?2 Series 207 I/O
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152 |
400-LFBGA |
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Microsemi Corporation |
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
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873 |
676-BGA |
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Xilinx Inc. |
400 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V
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167 |
400-LFBGA, CSPBGA |
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Microsemi Corporation |
896 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V
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796 |
896-BGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ 484 Pin M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
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120 |
484-BGA |
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Microsemi Corporation |
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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836 |
484-BGA |
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Microsemi Corporation |
896 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V
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401 |
896-BGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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735 |
484-BGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O
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773 |
784-BFBGA, FCBGA |
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Microsemi Corporation |
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V
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479 |
676-BGA |
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Microsemi Corporation |
536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
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226 |
536-LFBGA, CSPBGA |
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Microsemi Corporation |
676 Terminations-40°C~100°C TJ M2S090TS System On ChipSmartFusion?2 Series 425 I/O1.2V
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450 |
676-BGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
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668 |
484-BFBGA |
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Microsemi Corporation |
676 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V
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577 |
676-BGA |
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Microsemi Corporation |
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V
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570 |
676-BGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
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830 |
484-BFBGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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541 |
484-BGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O
|
298 |
784-BFBGA, FCBGA |
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