All Products

SoC

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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Xilinx Inc.
676 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 4 I/O
839
676-BBGA, FCBGA
Microsemi Corporation
676 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V
109
676-BGA
Xilinx Inc.
485 Terminations0°C~100°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V
444
484-LFBGA, CSPBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
510
484-BGA
Xilinx Inc.
484 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V
738
484-LFBGA, CSPBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
293
484-BGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
727
484-BGA
Microsemi Corporation
484 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
559
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
657
325-TFBGA, CSPBGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
302
676-BGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
250
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
651
325-TFBGA, CSPBGA
Microsemi Corporation
-40°C~100°C TJ 400 Pin M2S050TS System On ChipSmartFusion?2 Series 207 I/O
152
400-LFBGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
873
676-BGA
Xilinx Inc.
400 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V
167
400-LFBGA, CSPBGA
Microsemi Corporation
896 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V
796
896-BGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ 484 Pin M2S090T System On ChipSmartFusion?2 Series 267 I/O1.2V
120
484-BGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
836
484-BGA
Microsemi Corporation
896 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V
401
896-BGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
735
484-BGA
Xilinx Inc.
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O
773
784-BFBGA, FCBGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V
479
676-BGA
Microsemi Corporation
536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
226
536-LFBGA, CSPBGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ M2S090TS System On ChipSmartFusion?2 Series 425 I/O1.2V
450
676-BGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
668
484-BFBGA
Microsemi Corporation
676 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V
577
676-BGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V
570
676-BGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
830
484-BFBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
541
484-BGA
Xilinx Inc.
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O
298
784-BFBGA, FCBGA