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Thermal Management
Img
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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Rfq |
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ON Semiconductor |
32-VFQFN Exposed Pad, CSP Thermal Management
|
770 |
32-VFQFN Exposed Pad, CSP |
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ON Semiconductor |
16-SSOP (0.154, 3.90mm Width) Thermal Management
|
821 |
16-SSOP (0.154, 3.90mm Width) |
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ON Semiconductor |
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.9022mm mmLead Free
|
778 |
16-SSOP (0.154, 3.90mm Width) |
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ON Semiconductor |
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.9mm mm
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639 |
16-SSOP (0.154, 3.90mm Width) |
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Microchip Technology |
36-VFQFN Exposed Pad Thermal Management 6mm mm
|
607 |
36-VFQFN Exposed Pad |
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Maxim Integrated |
8-SOIC (0.154, 3.90mm Width) Thermal Management
|
924 |
8-SOIC (0.154, 3.90mm Width) |
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Maxim Integrated |
20-SSOP (0.154, 3.90mm Width) Thermal Management
|
292 |
20-SSOP (0.154, 3.90mm Width) |
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Melexis Technologies NV |
TO-39-4 Metal Can Thermal Management Lead Free
|
892 |
TO-39-4 Metal Can |
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Maxim Integrated |
24-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V V
|
830 |
24-SSOP (0.154, 3.90mm Width) |
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NXP USA Inc. |
8-VFDFN Exposed Pad Thermal Management
|
968 |
8-VFDFN Exposed Pad |
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Texas Instruments |
56-TFSOP (0.240, 6.10mm Width) Thermal Management 3.3V V14mm mmContains Lead
|
454 |
56-TFSOP (0.240, 6.10mm Width) |
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Texas Instruments |
48-WFQFN Exposed Pad Thermal Management 7mm mmContains Lead
|
687 |
48-WFQFN Exposed Pad |
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Nuvoton Technology Corporation of America |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management
|
771 |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) |
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Texas Instruments |
24-TSSOP (0.173, 4.40mm Width) Thermal Management Contains Lead
|
837 |
24-TSSOP (0.173, 4.40mm Width) |
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Renesas Electronics America Inc. |
8-WFDFN Exposed Pad, CSP Thermal Management
|
292 |
8-WFDFN Exposed Pad, CSP |
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Nuvoton Technology Corporation of America |
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Thermal Management
|
650 |
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) |
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Microchip Technology |
8-WFDFN Exposed Pad Thermal Management 3.3V V
|
473 |
8-WFDFN Exposed Pad |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
|
655 |
48-LQFP |
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NXP USA Inc. |
8-XFDFN Exposed Pad Thermal Management
|
180 |
8-XFDFN Exposed Pad |
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Maxim Integrated |
20-SSOP (0.154, 3.90mm Width) Thermal Management
|
542 |
20-SSOP (0.154, 3.90mm Width) |
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NXP USA Inc. |
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Thermal Management
|
532 |
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) |
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Texas Instruments |
24-WFQFN Exposed Pad Thermal Management Contains Lead
|
847 |
24-WFQFN Exposed Pad |
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Nuvoton Technology Corporation of America |
48-LQFP Thermal Management 5V V
|
738 |
48-LQFP |
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Microchip Technology |
28-VFQFN Exposed Pad Thermal Management 5mm mm
|
148 |
28-VFQFN Exposed Pad |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
|
603 |
48-LQFP |
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NXP USA Inc. |
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.9mm mm
|
229 |
16-SSOP (0.154, 3.90mm Width) |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
|
663 |
48-LQFP |
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Microchip Technology |
8-WFDFN Exposed Pad Thermal Management 2mm mm
|
658 |
8-WFDFN Exposed Pad |
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ON Semiconductor |
16-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V V4.9022mm mm
|
665 |
16-SSOP (0.154, 3.90mm Width) |
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Rochester Electronics, LLC |
14-CDIP (0.300, 7.62mm) Thermal Management
|
107 |
14-CDIP (0.300, 7.62mm) |
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