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Thermal Management

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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Linear Technology/Analog Devices
16-TFSOP (0.118, 3.00mm Width) Thermal Management 4.039mm mm
743
16-TFSOP (0.118, 3.00mm Width)
Microchip Technology
8-WFDFN Exposed Pad Thermal Management
437
8-WFDFN Exposed Pad
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V V4.98mm mmLead Free
310
16-SSOP (0.154, 3.90mm Width)
Linear Technology/Analog Devices
48-LQFP Thermal Management
899
48-LQFP
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V V4.98mm mmLead Free
788
16-SSOP (0.154, 3.90mm Width)
Analog Devices Inc.
16-SSOP (0.154, 3.90mm Width) 400kHz Thermal Management 5.5V V5mm mmContains Lead
579
16-SSOP (0.154, 3.90mm Width)
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 3.6V V4.89mm mmLead Free
117
16-SSOP (0.154, 3.90mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
244
24-TSSOP (0.173, 4.40mm Width)
Linear Technology/Analog Devices
48-LQFP Thermal Management
907
48-LQFP
Maxim Integrated
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 5.5V VLead Free
597
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Analog Devices Inc.
16-SSOP (0.154, 3.90mm Width) Thermal Management 5mm mmContains Lead
166
16-SSOP (0.154, 3.90mm Width)
Rochester Electronics, LLC
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management
772
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Microchip Technology
8-VFDFN Exposed Pad Thermal Management Lead Free
509
8-VFDFN Exposed Pad
Microchip Technology
12-VQFN Exposed Pad Thermal Management 3.3V V4.1mm mm
131
12-VQFN Exposed Pad
Microchip Technology
12-VQFN Exposed Pad Thermal Management 4mm mm
689
12-VQFN Exposed Pad
Rochester Electronics, LLC
24-SSOP (0.154, 3.90mm Width) Thermal Management 8.6614mm mm
577
24-SSOP (0.154, 3.90mm Width)
Microchip Technology
16-VQFN Exposed Pad Thermal Management 4mm mm
864
16-VQFN Exposed Pad
Microchip Technology
8-WFDFN Exposed Pad Thermal Management 3mm mm
688
8-WFDFN Exposed Pad
Microchip Technology
8-VFDFN Exposed Pad Thermal Management
211
8-VFDFN Exposed Pad
Microchip Technology
8-WFDFN Exposed Pad Thermal Management 3mm mm
747
8-WFDFN Exposed Pad
Rochester Electronics, LLC
24-SSOP (0.154, 3.90mm Width) Thermal Management
859
24-SSOP (0.154, 3.90mm Width)
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V VLead Free
154
16-SSOP (0.154, 3.90mm Width)
ON Semiconductor
24-VFQFN Exposed Pad Thermal Management 3.6V V4mm mmLead Free
794
24-VFQFN Exposed Pad
Microchip Technology
8-TSSOP (0.173, 4.40mm Width) Thermal Management 3mm mmLead Free
849
8-TSSOP (0.173, 4.40mm Width)
Maxim Integrated
16-WQFN Exposed Pad Thermal Management 5mm mm
628
16-WQFN Exposed Pad
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V VLead Free
924
16-SSOP (0.154, 3.90mm Width)
Maxim Integrated
8-SOIC (0.154, 3.90mm Width) Thermal Management Lead Free
906
8-SOIC (0.154, 3.90mm Width)
Texas Instruments
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V V4.9mm mmLead Free
663
16-SSOP (0.154, 3.90mm Width)
Linear Technology/Analog Devices
8-SOIC (0.154, 3.90mm Width) Thermal Management 4.9mm mm
856
8-SOIC (0.154, 3.90mm Width)
Texas Instruments
14-SOIC (0.154, 3.90mm Width) Thermal Management 8.65mm mmLead Free
970
14-SOIC (0.154, 3.90mm Width)