Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Weight | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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SMD2040 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | ||||||||||
SMD2SWLF.031 .7OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | SMD2 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG, 21 SWG | Tube, 0.7 oz (19.85g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||
SMD3SW.031 .7OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | SMD3 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 21 SWG | Tube, 0.7 oz (19.85g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||
SMDSW.031 .7OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Tube, 0.7 oz (19.85g) | Leaded | 361°F 183°C | No-Clean, Water Soluble | |||||||||||
SMDSWLF.015 .3OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Tube, 0.3 oz (8.51g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||
NC2SWLF.020 1LB | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | ||||||||||||
SMD2SWLF.020 2OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2 oz (56.70g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||
RASWLF.015 1LB | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | ||||||||||||
SMDAG100-S-1 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Solder Shot | Ag100(100) | Bag, 1 oz (28g) | Lead Free | 1762°F 961°C | ||||||||||||||
NCSWLF.031 1LB | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||||
NC3SW.031 1LB | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 354°F 179°C | No-Clean | ||||||||||||
SMD2195-25000 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | SMD2 | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||
NCSWLF.020 1LB | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||||
SMD291SNL250T5 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||
RASW.031 1OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 21 AWG, 20 SWG | Spool, 1 oz (28.35g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||
SMD2SW.020 4OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 4 oz (113.40g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | ||||||||||||
SMDSW.031 1OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | 0.062lb 28.12g | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 oz (28.35g) | Leaded | 361°F 183°C | No-Clean, Water Soluble | ||||||||||
SMD2040-25000 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | Jar | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | ||||||||||
RASW.031 4OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 21 AWG, 20 SWG | Spool, 4 oz (113.40g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||
TS391SNL50 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||||
BARSN42BI57AG1-8OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn42Bi57Ag1 (42/57/1) | Bar, 0.5 lb (227g) | Lead Free | 280°F 138°C | ||||||||||||||
SMDSWLF.031 4OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | 0.25lb 113.4g | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 4 oz (113.40g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||
TS391SNL250 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||||
SMDSWLF.008 50G | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.008 0.20mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 32 AWG, 35 SWG | Spool, 1.76 oz (50g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||
SMD291SNL50T3 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.113lb 51.26g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||
SMDIN52SN48 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | In52Sn48 (52/48) | 20 AWG, 21 SWG | Spool | Lead Free | 244°F 118°C | ||||||||||||
SMD291AX10T5 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | Non-RoHS Compliant | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | No-Clean | |||||||
SMD291AX250T4 | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 3 Weeks | Jar | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | |||||||||
RASW.020 .4OZ | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Tube, 0.4 oz (11.34g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||
RASW.015 100G | Chip Quik Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 3.53 oz (100g) | Leaded | 361°F 183°C | Rosin Activated (RA) |
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