Products
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Depth | Operating Supply Voltage | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Frequency | Height | Width | Mounting Type | Operating Temperature | Size / Dimension | Technology | Operating Supply Current | Max Supply Current | Height Seated (Max) | Ratings | HTS Code | Number of Functions | Physical Dimension | Nominal Supply Current | Type | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Sensitivity | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Subcategory | Power Supplies | Supply Voltage-Max (Vsup) | Max Power Dissipation | Number of Cells | Output Voltage | Battery Chemistry | Output Current | Charge Current - Max | Analog IC - Other Type | Data Rate | Frequency Stability | Load Capacitance | Operating Frequency | Output | Supply Current-Max (Isup) | Watchdog Timer | Adjustable Threshold | Speed | Rise Time-Max | Fall Time-Max | Symmetry-Max | Oscillator Type | Access Time | Power - Output | Screening Level | Memory Size | Function | Core Processor | RAM Size | Number of I/O | Telecom IC Type | Voltage - Supply | Fault Protection | Protocol | Data Bus Width | Number of Timers/Counters | uPs/uCs/Peripheral ICs Type | Peripherals | RAM (words) | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Max Duty Cycle | On Chip Data RAM Width | Current - Supply (Max) | Voltage - Supply (Vcc/Vdd) | Programmable Features | Current - Charging | Battery Pack Voltage | Sensitivity (dBm) | Utilized IC / Part | RF Family/Standard | Antenna Type | Current - Receiving | Current - Transmitting | Serial Interfaces | Modulation | Firmware Version | Program Memory Type | Base Resonator | Current - Supply (Disable) (Max) | Core Size | Program Memory Size |
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RN4678APL-V/RM120 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
20 Weeks | Active | 1 (Unlimited) | Module | compliant | 2.4GHz | Surface Mount | -20°C~70°C | -92dBm | 1Mbps | 1.5dBm | 4MB Flash 320kB ROM 28kB SRAM | TELECOM CIRCUIT | 3.3V~4.2V | Bluetooth v5.0 | IS1678SM | Bluetooth | Integrated, Chip | 37mA | 43mA | I2C, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
RN41HCI-I/RM | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Bulk | 2012 | Active | 3 (168 Hours) | 32 | 25.8mm | ROHS3 Compliant | Lead Free | 35-SMD Module | UART | 2.4GHz | 13.2mm | Surface Mount | -40°C~85°C | 2.2mm | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) | UNSPECIFIED | NO LEAD | 250 | 3.3V | 40 | RN41 | R-XXMA-N32 | 3Mbps | 16dBm | TELECOM CIRCUIT | 3V~3.6V | Bluetooth v2.1 +EDR, Class 1 | -80 dBm | Bluetooth | Integrated, Chip | 35mA | 65mA | SPI, UART, USB | FHSS, GFSK | HCI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ATZB-S1-256-3-0-CR | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 13 Weeks | Surface Mount | Tape & Reel (TR) | 1999 | ZigBit™ | yes | Active | 3 (168 Hours) | 42 | 3V | 30mm | ROHS3 Compliant | Lead Free | No | 42 | Module | SPI, UART, USART | 2.4GHz | 20mm | Surface Mount | -40°C~85°C | 3.2mm | 1 | UNSPECIFIED | 3V | 1mm | 16 | 2Mbps | 3.5dBm | 256kB Flash 8kB EEPROM 32kB SRAM | 32kB | TELECOM CIRCUIT | 1.8V~3.6V | Zigbee® | -97 dBm | 802.15.4 | Integrated, Chip | 9.6mA~17mA | 9.9mA~16.3mA | ISP, JTAG, SPI, UART, USART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
RN41APL-I/RM550 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tray | 2012 | yes | Active | 3 (168 Hours) | 32 | 25.8mm | ROHS3 Compliant | Module | SPI, UART, USB | 2.4GHz | 13.2mm | Surface Mount | -40°C~85°C | 2.1mm | 1 | UNSPECIFIED | NO LEAD | 3.3V | RN41 | R-XXMA-N32 | 3Mbps | 18dBm | TS 16949 | TELECOM CIRCUIT | 3V~3.6V | Bluetooth v2.1 + EDR | -86 dBm | Bluetooth | Integrated, Chip | 35mA | 65mA | SPI, UART, USB | 5.5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BM70BLES1FC2-0B04AA | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Active | 1 (Unlimited) | 33 | 22mm | 33-SMD Module | compliant | 2.4GHz | 12mm | Surface Mount | -40°C~85°C | 2.4mm | 1 | UNSPECIFIED | NO LEAD | 3V | BM70 | -90dBm | YES | R-XXMA-N33 | 8.6 Mbps | 0dBm | TELECOM CIRCUIT | 1.9V~3.6V | Bluetooth v5.0 | Bluetooth | Integrated, Chip | 13mA | I2C, SPI, UART | 1.11 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ATWILC3000-MR110UA | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tray | 2016 | yes | Active | 3 (168 Hours) | 36 | 3.6V | 22.428mm | ROHS3 Compliant | Lead Free | 48 | SEATED HGT-CALCULATED | Module | I2C, SPI, UART | 2.4GHz | Surface Mount | -40°C~85°C | CMOS | 2.087mm | UNSPECIFIED | NO LEAD | 3.3V | ATWILC3000 | R-XXMA-N36 | 1 | 65Mbps | 19dBm | 3.3V | 802.11b/g/n, Bluetooth v4.0 | MICROPROCESSOR CIRCUIT | -98 dBm | Bluetooth, WiFi | Antenna Not Included, U.FL | 68mA | 230mA | I2C, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BM71BLES1FC2-0B04AA | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Active | 1 (Unlimited) | 16 | 11.5mm | 16-SMD Module | compliant | 2.4GHz | 9mm | Surface Mount | -40°C~85°C | 2.1mm | 1 | UNSPECIFIED | NO LEAD | 3V | BM71 | -90dBm | YES | 1.2mm | R-XXMA-N16 | 8.6 Mbps | 0dBm | TELECOM CIRCUIT | 1.9V~3.6V | Bluetooth v5.0 | Bluetooth | Integrated, Chip | 13mA | UART | 1.11 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MRF24WB0MB/RM | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2008 | yes | Obsolete | 1 (Unlimited) | 36 | 21mm | 3.3V | 31mm | ROHS3 Compliant | Lead Free | No | 36 | Module | SPI | No SVHC | 2.4GHz | 2.6924mm | 30.988mm | Surface Mount | -40°C~85°C | 8542.39.00.01 | 1 | 154mA | e3 | Matte Tin (Sn) | UPPER | 3.3V | MRF24WB0M | 2Mbps | 10dBm | TELECOM CIRCUIT | 2.7V~3.6V | 802.11b | -91 dBm | WiFi | Antenna Not Included, U.FL | 85mA | 115mA~154mA | JTAG, SPI | DSSS | B0C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1121DI1-026.6000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1121 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 6-SMD, No Lead | 26.6MHz | 889μm | Surface Mount | -40°C~85°C | 0.098Lx0.079W 2.50mmx2.00mm | 35mA | 0.035 0.90mm | 2.5mm x 2.0mm x 0.9mm | XO (Standard) | ±50ppm | 26.6MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 2.25V~3.6V | MEMS | 22mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001BI2-006.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | 4 | ROHS3 Compliant | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 4-SMD, No Lead | 6MHz | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 6.3mA | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.9mm | XO (Standard) | 3.3V | ±25ppm | 6MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001CL1-048.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead | 48MHz | 889μm | Surface Mount | -40°C~105°C | 0.126Lx0.098W 3.20mmx2.50mm | 7.2mA | 0.035 0.90mm | AEC-Q100 | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | 3.3V | ±50ppm | 48MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001CL1-001.6000T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tape & Reel (TR) | DSC1001 | yes | Active | 3 (168 Hours) | 4 | ROHS3 Compliant | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 4-SMD, No Lead | 1.6MHz | 889μm | Surface Mount | -40°C~105°C | 0.126Lx0.098W 3.20mmx2.50mm | 6.3mA | 0.035 0.90mm | AEC-Q100 | 3.2mm x 2.5mm x 0.9mm | XO (Standard) | 3.3V | ±50ppm | 1.6MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001BI2-033.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | 4 | ROHS3 Compliant | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 4-SMD, No Lead | 33MHz | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 7.2mA | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.9mm | XO (Standard) | 3.3V | ±25ppm | 33MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001CL1-001.8432T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tape & Reel (TR) | DSC1001 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead | 1.8432MHz | 889μm | Surface Mount | -40°C~105°C | 0.126Lx0.098W 3.20mmx2.50mm | 6.3mA | 0.035 0.90mm | AEC-Q100 | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | 3.3V | ±50ppm | 1.8432MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001CL1-030.0000T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Standard, Surface Mount | Tape & Reel (TR) | DSC1001 | yes | Active | 3 (168 Hours) | SMD/SMT | ROHS3 Compliant | 4-SMD, No Lead | 30MHz | 889μm | Surface Mount | -40°C~105°C | 0.126Lx0.098W 3.20mmx2.50mm | 7.2mA | 0.035 0.90mm | AEC-Q100 | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | 3.3V | ±50ppm | 15pF | 30MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 55 % | MEMS | 15μA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1004AL1-001.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1004 | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead Exposed Pad | 1MHz | 889μm | Surface Mount | -40°C~105°C | 0.276Lx0.197W 7.00mmx5.00mm | 6.5mA | 0.035 0.90mm | AEC-Q100 | 7.0mm x 5.0mm x 0.85mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3.3V | ±50ppm | 1MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | MEMS | 15μA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001DE1-075.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead | 75MHz | 889μm | Surface Mount | -20°C~70°C | 0.098Lx0.079W 2.50mmx2.00mm | 8.7mA | 0.035 0.90mm | AEC-Q100 | 2.5mm x 2.0mm x 0.85mm | XO (Standard) | 3.3V | ±50ppm | 75MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001DL2-013.5000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 9 Weeks | Tube | DSC1001 | Active | 1 (Unlimited) | ROHS3 Compliant | 4-SMD, No Lead | 13.5MHz | Surface Mount | -40°C~105°C | 0.098Lx0.079W 2.50mmx2.00mm | 0.035 0.90mm | AEC-Q100 | 2.5mm x 2.0mm x 0.85mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3.3V | YES | ±25ppm | 13.5MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 6.3mA | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001DE1-100.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | Solder | 3.3V | ROHS3 Compliant | 4-SMD, No Lead | 100MHz | 889μm | Surface Mount | -20°C~70°C | 0.098Lx0.079W 2.50mmx2.00mm | 8.7mA | 0.035 0.90mm | AEC-Q100 | 2.5mm x 2.0mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | 3.3V | ±50ppm | 15pF | 100MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 55 % | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ATZB-RF-212B-0-CN | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 13 Weeks | Surface Mount | Bulk | 2015 | ZigBit™ | yes | Active | 1 (Unlimited) | ROHS3 Compliant | Lead Free | 42 | Module | 900MHz | Surface Mount | -40°C~85°C | 1Mbps | 11dBm | 1.8V~3.6V | Zigbee® | -103 dBm | AT86RF212B | 802.15.4 | Integrated, Chip | 9.3mA | 5mA~26.9mA | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
RN4870-V/RM118 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2017 | Active | 1 (Unlimited) | 33 | 22mm | ROHS3 Compliant | Lead Free | 33-SMD Module | No SVHC | 2.4GHz | 12mm | Surface Mount | -20°C~70°C | 2.4mm | 8542.39.00.01 | 1 | UNSPECIFIED | NO LEAD | 3.3V | RN4870 | -90dBm | NO | 1.1mm | R-XXMA-N33 | 10 Mbps | 0dBm | TELECOM CIRCUIT | 1.9V~3.6V | Bluetooth v5.0 | Bluetooth | Integrated, Chip | 13mA | UART | GFSK | 1.1.8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC16C56-RCI/SO | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Tube | PIC® 16C | yes | Active | 1 (Unlimited) | 18 | ROHS3 Compliant | Lead Free | No | 18 | 18-SOIC (0.295, 7.50mm Width) | 4MHz | Surface Mount | -40°C~85°C TA | CMOS | 2.64mm | DUAL | GULL WING | 5V | PIC16C56 | 18 | YES | 3V | 6.25V | 800mW | Yes | 40 MHz | External | 4 μs | 1.5kB | PIC | 25 x 8 | 12 | 8b | 1 | MICROCONTROLLER, RISC | POR, WDT | 25 | 8 | NO | NO | NO | NO | 8 | 3V~6.25V | OTP | 8-Bit | 1.5KB 1K x 12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1121AM2-004.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1121 | yes | Active | 1 (Unlimited) | ROHS3 Compliant | 6-SMD, No Lead Exposed Pad | 4MHz | 889μm | Surface Mount | -55°C~125°C | 0.276Lx0.197W 7.00mmx5.00mm | 35mA | 0.035 0.90mm | 7.0mm x 5.0mm x 0.9mm | XO (Standard) | e3 | Matte Tin (Sn) | ±25ppm | 4MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 2.25V~3.6V | MEMS | 22mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001AI5-080.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead Exposed Pad | 80MHz | 889μm | Surface Mount | -40°C~85°C | 0.276Lx0.197W 7.00mmx5.00mm | 8.7mA | 0.035 0.90mm | AEC-Q100 | 7.0mm x 5.0mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | 3.3V | ±10ppm | 80MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001AI5-100.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead Exposed Pad | 100MHz | 889μm | Surface Mount | -40°C~85°C | 0.276Lx0.197W 7.00mmx5.00mm | 8.7mA | 0.035 0.90mm | AEC-Q100 | 7.0mm x 5.0mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | 3.3V | ±10ppm | 100MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001DL5-075.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 9 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead | 75MHz | 889μm | Surface Mount | -40°C~105°C | 0.098Lx0.079W 2.50mmx2.00mm | 8.7mA | 0.035 0.90mm | AEC-Q100 | 2.5mm x 2.0mm x 0.85mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3.3V | ±10ppm | 75MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MCP73834-CNI/UN | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 6 Weeks | Surface Mount | Tube | 2009 | yes | Active | 1 (Unlimited) | 10 | EAR99 | ROHS3 Compliant | Lead Free | No | 10 | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | 6V | 3.75V | Surface Mount | -40°C~85°C TA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 40 | MCP73834 | 0.5mm | Power Management Circuits | 3.8/5.5V | 1 | 4.5V | Lithium Ion/Polymer | 1.2A | 1.1A | 3mA | Over Temperature | Current | Constant - Programmable | 4.2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MCP73833T-GPI/MF | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2006 | yes | Active | 1 (Unlimited) | 10 | EAR99 | 3mm | ROHS3 Compliant | No | 10 | 10-VFDFN Exposed Pad | 6V | 3.75V | 3mm | Surface Mount | -40°C~85°C TA | 2mA | 1 | 2mA | e3 | Matte Tin (Sn) | DUAL | 260 | 40 | MCP73833 | 10 | 0.5mm | 1 | Power Management Circuits | 3.8/5.5V | 1 | 4.5V | Lithium Ion/Polymer | 1.2A | 1.1A | POWER SUPPLY SUPPORT CIRCUIT | 3mA | YES | Over Temperature | Current | Constant - Programmable | 4.2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MCP73827-4.1VUATR | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 5 Weeks | Surface Mount | Tape & Reel (TR) | yes | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | Lead Free | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 5.5V | 4.5V | 3mm | Surface Mount | -20°C~85°C TA | 560mA | 1 | 560mA | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 5.1V | 40 | MCP73827 | 8 | 0.65mm | 1 | Power Management Circuits | 5V | 1 | 4.1V | Lithium-Ion | POWER SUPPLY SUPPORT CIRCUIT | 0.56mA | YES | Constant - Programmable | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MCP73838-FJI/UN | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 13 Weeks | Surface Mount | Tube | 2011 | yes | Active | 1 (Unlimited) | 10 | 3mm | ROHS3 Compliant | No | 10 | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | USB | 6V | 3.75V | 3mm | Surface Mount | -40°C~85°C TA | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5.2V | 40 | MCP73838 | 0.5mm | 1 | 1 | 4.5V | Lithium Ion/Polymer | 1.2A | 1.1A | POWER SUPPLY SUPPORT CIRCUIT | YES | Over Voltage | Constant - Programmable | 4.2V |
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