All Products
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Integrated Circuits (ICs)
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Connectors
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Discrete Semiconductors
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Capacitors
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Sensors
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RF/IF & RFID
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- Inductors
- Filters
NXP USA Inc.(17569)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Package / Case | Interface | Reach Compliance Code | Width | Mounting Type | Operating Temperature | Technology | Input Type | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Output Type | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Subcategory | Qualification Status | Supply Voltage-Max (Vsup) | Number of Outputs | Feature | Analog IC - Other Type | Switch Type | Applications | Supply Current-Max (Isup) | Built-in Protections | Output Current Flow Direction | Adjustable Threshold | Speed | Output Configuration | Turn On Time | Core Processor | RAM Size | Number of I/O | Voltage - Supply | Fault Protection | Output Peak Current Limit-Nom | uPs/uCs/Peripheral ICs Type | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Turn Off Time | Voltage - Supply (Vcc/Vdd) | Voltage - Load | Rds On (Typ) | Current - Output (Max) | Ratio - Input:Output | Program Memory Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC16XSD200BFKR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 23-PowerQFN | SPI | Surface Mount | -40°C~125°C TA | 2 | General Purpose | High Side | Open Load Detect, Over Temperature, Over Voltage | 3V~5.5V | 8V~36V | 16m Ω | 3A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NX30P6093UKZ | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | NX3 | Obsolete | Not Applicable | ROHS3 Compliant | 20-UFBGA, WLCSP | I2C | Surface Mount | -40°C~85°C TA | P-Channel | 1 | Slew Rate Controlled | USB Switch | Over Temperature, Over Voltage | 3V~4.5V | 2.8V~20V | 8.95m Ω | 8A | 1:1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NX3P191UK,012 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Tape & Reel (TR) | 2011 | Obsolete | 1 (Unlimited) | 4 | 0.76mm | ROHS3 Compliant | 4-UFBGA, WLCSP | On/Off | 0.76mm | Surface Mount | -40°C~125°C TJ | Non-Inverting | 0.54mm | 1 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | NX3P191 | 4 | P-Channel | YES | 0.4mm | S-PBGA-B4 | 1 | 3.6V | 1 | Load Discharge, Slew Rate Controlled | SPST | General Purpose | High Side | Not Required | 1.1V~3.6V | 65m Ω | 500mA | 1:1 | ||||||||||||||||||||||||||||||||||||||
| BUK128-50DL,118 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 2001 | TOPFET™ | Obsolete | 1 (Unlimited) | 2 | EAR99 | ROHS3 Compliant | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB | On/Off | unknown | Surface Mount | 150°C TJ | Non-Inverting | 4.5mm | 1 | e3 | TIN | SINGLE | GULL WING | 260 | 40 | BUK1 | 3 | N-Channel | YES | 2.54mm | R-PSSO-G2 | Not Qualified | 1 | General Purpose | OVER CURRENT; OVER VOLTAGE; THERMAL | SOURCE | Low Side | 20 μs | Current Limiting (Fixed), Over Temperature, Over Voltage | 12A | 70 μs | Not Required | 50V Max | 68m Ω | 8A | 1:1 | ||||||||||||||||||||||||||||||||||
| MC06XS4200FK | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
99 Weeks | Tray | 2011 | Not For New Designs | 3 (168 Hours) | 23 | EAR99 | ROHS3 Compliant | 23-PowerQFN | SPI | Surface Mount | -40°C~125°C TA | MOS | 1 | BOTTOM | BUTT | 260 | 24V | 40 | MC06XS4200 | N-Channel | YES | 8V | 36V | 2 | Internal PWM, Slew Rate Controlled | General Purpose | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SINK | High Side | Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage | 9A | 3V~5.5V | 8V~36V | 6m Ω (Max) | 9A | 1:1 | |||||||||||||||||||||||||||||||||||||||||
| MC07XS6517BEK | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 15 Weeks | Tube | 2015 | Active | 3 (168 Hours) | EAR99 | ROHS3 Compliant | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | SPI | Surface Mount | -40°C~125°C TA | 8542.39.00.01 | N-Channel | 6 | Internal PWM | General Purpose | High Side | Current Limiting (Fixed), Open Load Detect, Over Temperature | 4.5V~5.5V | 7V~18V | 7m Ω, 17m Ω | 5.5A 11A | 1:1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC08XS6421CEK | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | SPI | -40°C~125°C TA | CMOS | 260 | NOT SPECIFIED | N-Channel | 4 | General Purpose | High Side | Current Limiting (Fixed), Open Load Detect, Over Temperature | 4.5V~5.5V | 7V~18V | 8m Ω, 21m Ω | 5.5A 11A | 1:1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC08XS6421BEK | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 20 Weeks | Tube | yes | Not For New Designs | 3 (168 Hours) | ROHS3 Compliant | 32-SSOP (0.295, 7.50mm Width) Exposed Pad | SPI | Surface Mount | -40°C~125°C TA | 260 | NOT SPECIFIED | N-Channel | 4 | General Purpose | High Side | Current Limiting (Fixed), Open Load Detect, Over Temperature | 4.5V~5.5V | 7V~18V | 8m Ω, 21m Ω | 5.5A 11A | 1:1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGT1/T0B0408, | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tape & Reel (TR) | 2011 | Obsolete | 1 (Unlimited) | 8-SOIC (0.154, 3.90mm Width) | I2C | Surface Mount | -25°C~90°C TA | Authentication | MX51 | 1.62V~3.6V | EEPROM (20kB) | A710x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7004CMHN1/T1AGBEL | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
2011 | Active | 32-VFQFN Exposed Pad | I2C | Surface Mount | -40°C~90°C TA | Authentication | MX51 | 3.2kB | 1.62V~5.5V | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7102CGHN1/T0B041J | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tape & Reel (TR) | 2011 | Active | 32-VFQFN Exposed Pad | I2C | Surface Mount | -40°C~90°C TA | Authentication | MX51 | 1.62V~3.6V | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7002CGHN1/T1AG502 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
2011 | Active | 32-VFQFN Exposed Pad | I2C | Surface Mount | -40°C~90°C | Authentication | MX51 | 3.2kB | 1.62V~5.5V | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGTK2/T0B0405 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tape & Reel (TR) | 2011 | Active | 8-VDFN Exposed Pad | I2C | Surface Mount | -25°C~90°C TA | Authentication | MX51 | 1.62V~3.6V | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7002CMHN1/T1AGBEL | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 25 Weeks | Tape & Reel (TR) | 2011 | Active | 1 (Unlimited) | ROHS3 Compliant | I2C, 2-Wire Serial | -40°C~90°C | Authentication | MX51 | 3.2kB | 1.62V~5.5V | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7004CIHN1/T1AGBAJ | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tape & Reel (TR) | 2011 | Active | 32-VFQFN Exposed Pad | I2C | Surface Mount | -40°C~90°C TA | Authentication | MX51 | 3.2kB | 1.62V~5.5V | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912H634DV1AER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
16 Weeks | Tape & Reel (TR) | 2010 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | LIN, SCI | Surface Mount | -40°C~105°C | e3 | Matte Tin (Sn) | 260 | 40 | MM912H634 | ANALOG CIRCUIT | Automotive | S12 | 6K x 8 | 9 | 2.25V~5.5V | FLASH (64kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGTK2/T0B040X | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tape & Reel (TR) | 2011 | Active | 8-VDFN Exposed Pad | I2C | Surface Mount | -25°C~90°C TA | Authentication | MX51 | 1.62V~3.6V | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912G634DC2APR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
18 Weeks | Tape & Reel (TR) | 2010 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | LIN, SCI | Surface Mount | -40°C~105°C | MM912G634 | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (48kB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912J637AV1EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
26 Weeks | Tray | 2015 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-VFQFN Exposed Pad | LIN, SCI, SPI | 7mm | Surface Mount | -40°C~105°C | BICMOS | 0.9mm | 1 | e3 | Matte Tin (Sn) | QUAD | NO LEAD | 260 | 40 | MM912J637 | YES | 0.5mm | 3.5V | 1 | Power Management Circuits | Not Qualified | POWER SUPPLY MANAGEMENT CIRCUIT | Battery Monitor | 25mA | YES | S12 | 6K x 8 | 8 | 2.25V~5.5V | FLASH (128kB) | HCS12 | ||||||||||||||||||||||||||||||||||||||
| MM912I637AM2EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
26 Weeks | Tape & Reel (TR) | 2012 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-VFQFN Exposed Pad | LIN, SCI, SPI | 7mm | Surface Mount | -40°C~125°C | BICMOS | 0.9mm | 1 | e3 | Matte Tin (Sn) | QUAD | NO LEAD | 260 | 40 | MM912I637 | YES | 0.5mm | 3.5V | 1 | Power Management Circuits | Not Qualified | POWER SUPPLY MANAGEMENT CIRCUIT | Battery Monitor | 25mA | YES | S12 | 6K x 8 | 8 | 2.25V~5.5V | FLASH (96KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||
| MM912G634DV2AP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
16 Weeks | Tray | 2006 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | LIN, SCI | Surface Mount | -40°C~105°C | e3 | Matte Tin (Sn) | 260 | 40 | MM912G634 | ANALOG CIRCUIT | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM908E624ACPEW | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
16 Weeks | Tube | 2003 | Active | 3 (168 Hours) | 54 | 3A991.A.2 | 17.9mm | ROHS3 Compliant | 54-BSSOP (0.295, 7.50mm Width) | SCI, SPI | 7.5mm | Surface Mount | -40°C~85°C | MOS | 2.65mm | 8542.39.00.01 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 9V | 40 | MM908E624 | YES | 0.65mm | R-PDSO-G54 | Microcontrollers | Not Qualified | Automotive Mirror Control | 32 MHz | HC08 | 512 x 8 | 16 | 5.5V~18V | MICROCONTROLLER | 9.8304MHz | 8 | YES | NO | YES | NO | FLASH (16kB) | 908E | |||||||||||||||||||||||||||||||||
| MM912F634DV1AER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | 2010 | Active | 3 (168 Hours) | 48 | 7mm | ROHS3 Compliant | 48-LQFP Exposed Pad | LIN, SCI | 7mm | Surface Mount | -40°C~105°C | CMOS | 1.6mm | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 7V | 40 | MM912F634 | YES | 0.5mm | S-PQFP-G48 | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | MICROPROCESSOR CIRCUIT | FLASH (32KB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||
| MM912F634DV2AP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2010 | Active | 3 (168 Hours) | 48 | 7mm | ROHS3 Compliant | 48-LQFP | LIN, SCI | 7mm | Surface Mount | -40°C~105°C | CMOS | 1.6mm | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 7V | 40 | MM912F634 | YES | 0.5mm | S-PQFP-G48 | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | MICROPROCESSOR CIRCUIT | FLASH (32KB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||
| MM912G634DM1AER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
16 Weeks | Tape & Reel (TR) | 2010 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | LIN, SCI | Surface Mount | -40°C~105°C | e3 | Matte Tin (Sn) | 260 | 40 | MM912G634 | ANALOG CIRCUIT | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912G634DV2APR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
16 Weeks | Tape & Reel (TR) | 2010 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | LIN, SCI | Surface Mount | -40°C~105°C | e3 | Matte Tin (Sn) | 260 | 40 | MM912G634 | ANALOG CIRCUIT | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912J637AV1EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
26 Weeks | Tape & Reel (TR) | 2012 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-VFQFN Exposed Pad | LIN, SCI, SPI | 7mm | Surface Mount | -40°C~105°C | BICMOS | 0.9mm | 1 | e3 | Matte Tin (Sn) | QUAD | NO LEAD | 260 | 40 | MM912J637 | YES | 0.5mm | 3.5V | 1 | Power Management Circuits | Not Qualified | POWER SUPPLY MANAGEMENT CIRCUIT | Battery Monitor | 25mA | YES | S12 | 6K x 8 | 8 | 2.25V~5.5V | FLASH (128kB) | HCS12 | ||||||||||||||||||||||||||||||||||||||
| MM912F634DV2APR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | 2010 | Active | 3 (168 Hours) | 48 | 7mm | ROHS3 Compliant | 48-LQFP | LIN, SCI | 7mm | Surface Mount | -40°C~105°C | CMOS | 1.6mm | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 7V | 40 | MM912F634 | YES | 0.5mm | S-PQFP-G48 | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | MICROPROCESSOR CIRCUIT | FLASH (32KB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||
| PNX9531E/V140,557 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | Obsolete | 1 (Unlimited) | 456-BGA | GPIO, Host Interface, I2C, PCI, USB, XIO | Surface Mount | -40°C~85°C TA | Multimedia | TriMedia™ | 8 | 1.16V~1.24V 3.15V~3.6V | Nexperia | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7005CGHN1/T1AGAEL | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
22 Weeks | 2011 | Active | 32-VFQFN Exposed Pad | I2C | Surface Mount | -25°C~85°C TA | Authentication | MX51 | 3.2kB | 1.62V~5.5V | EEPROM (76.4kB) | A700x |