Products
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Additional Feature | Package / Case | Width | Mounting Type | Operating Temperature | Technology | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Output Type | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Number of Channels | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Power - Max | Number of Elements | Configuration | Analog IC - Other Type | Number of Circuits | Polarity/Channel Type | Power Dissipation-Max (Abs) | Load Capacitance | Output | On-State Resistance (Max) | -3db Bandwidth | Speed | Oscillator Type | Propagation Delay (tpd) | Transistor Application | Number of Inputs | Transistor Element Material | Transistor Type | Transition Frequency | Current - Collector Cutoff (Max) | Voltage - Collector Emitter Breakdown (Max) | Current - Collector (Ic) (Max) | Ethernet | USB | SATA | Core Processor | RAM Size | Number of I/O | Address Bus Width | Supply Current-Max | Voltage - Supply | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Barrel Shifter | uPs/uCs/Peripheral ICs Type | Peripherals | Family | Max I(ol) | Clock Frequency | Switch-on Time-Max | Switch-off Time-Max | Switching | Normal Position | Off-state Isolation-Nom | On-state Resistance Match-Nom | RAM (words) | Prop. Delay@Nom-Sup | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Schmitt Trigger Input | Signal Current-Max | Current - Output High, Low | Logic Type | Voltage - Supply (Vcc/Vdd) | ROM (words) | On Chip Program ROM Width | CPU Family | Integrated Cache | DC Current Gain (hFE) (Min) @ Ic, Vce | Vce Saturation (Max) @ Ib, Ic | Frequency - Transition | Resistor - Base (R1) | Resistor - Emitter Base (R2) | Internal Bus Architecture | Voltage - I/O | EEPROM Size | Program Memory Type | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Co-Processors/DSP | Security Features | Additional Interfaces | Connectivity | Switch Circuit | Voltage - Supply, Single (V+) | Multiplexer/Demultiplexer Circuit | Current - Leakage (IS(off)) (Max) | Channel Capacitance (CS(off), CD(off)) | Switch Time (Ton, Toff) (Max) | Charge Injection | Channel-to-Channel Matching (ΔRon) | Crosstalk | Core Size | Program Memory Size | Data Converter |
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MPC8544ECVTALFA | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2007 | MPC85xx | Obsolete | 3 (168 Hours) | 783 | 5A002.A | 29mm | ROHS3 Compliant | 783-BBGA, FCBGA | -40°C~105°C TA | CMOS | 3.38mm | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | BOTTOM | BALL | 260 | 1V | 40 | MPC8544 | YES | 1mm | S-PBGA-B783 | 0.95V | 1.05V | 667MHz | 10/100/1000Mbps (2) | PowerPC e500 | 32 | YES | YES | 32 | FLOATING POINT | MICROPROCESSOR | 133MHz | 32 | YES | 1.8V 2.5V 3.3V | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | DUART, I2C, PCI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
P4040NSN1PNB | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2009 | QorIQ P4 | Obsolete | 3 (168 Hours) | 3A991.A.1 | 37.5mm | ROHS3 Compliant | 1295-BBGA, FCBGA | 0°C~105°C TA | CMOS | 3.53mm | 8542.31.00.01 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1V | 30 | P4040 | YES | 1mm | S-PBGA-B1295 | 0.95V | 1.05V | 1.5GHz | 1Gbps (8), 10Gbps (2) | USB 2.0 + PHY (2) | PowerPC e500mc | 16 | YES | YES | 64 | FIXED POINT | MICROPROCESSOR, RISC | 133.3MHz | YES | 1.8V 2.5V 3.3V | 4 Core 32-Bit | No | DDR2, DDR3 | DUART, I2C, MMC/SD, RapidIO, SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
P4080NSN1NNB | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2013 | QorIQ P4 | Obsolete | 3 (168 Hours) | 3A991.A.1 | 37.5mm | ROHS3 Compliant | 1295-BBGA, FCBGA | 0°C~105°C TA | CMOS | 3.53mm | 8542.31.00.01 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1V | 30 | P4080 | YES | 1mm | S-PBGA-B1295 | 0.95V | 1.05V | 1.5GHz | 1Gbps (8), 10Gbps (2) | USB 2.0 + PHY (2) | PowerPC e500mc | 32 | YES | YES | 16 | FIXED POINT | MICROPROCESSOR, RISC | 133.3MHz | YES | 1.8V 2.5V 3.3V | 8 Core 32-Bit | No | DDR2, DDR3 | DUART, I2C, MMC/SD, RapidIO, SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MPC8536CVTAQGA | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2006 | MPC85xx | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 783-BBGA, FCBGA | -40°C~105°C TA | MPC8536 | 1.0GHz | 10/100/1000Mbps (2) | USB 2.0 (3) | SATA 3Gbps (2) | PowerPC e500 | 1.8V 2.5V 3.3V | 1 Core 32-Bit | No | DDR2, DDR3 | DUART, I2C, MMC/SD, PCI, SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MK02FN64VFM10 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
13 Weeks | Tray | 2012 | Kinetis K02 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | 5mm | ROHS3 Compliant | 32-VFQFN Exposed Pad | 5mm | Surface Mount | -40°C~105°C TA | CMOS | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 40 | YES | 0.5mm | S-XQCC-N32 | 1.71V | 3.6V | 100MHz | Internal | ARM® Cortex®-M4 | 16K x 8 | 26 | MICROCONTROLLER, RISC | DMA, LVD, POR, PWM | 50MHz | YES | YES | YES | YES | 1.71V~3.6V | FLASH | I2C, SPI, UART/USART | 32-Bit | 64KB 64K x 8 | A/D 12x16b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MC9S08AW60CPUE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2005 | S08 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | 10mm | ROHS3 Compliant | 64-LQFP | 10mm | Surface Mount | -40°C~85°C TA | CMOS | 1.6mm | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3V | 40 | MC9S08AW60 | YES | 0.5mm | S-PQFP-G64 | 2.7V | Microcontrollers | Not Qualified | 3/5V | 5.5V | 40MHz | Internal | 2K x 8 | 54 | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | 8 | YES | NO | YES | NO | 2.7V~5.5V | 63280 | FLASH | I2C, SCI, SPI | 8-Bit | 60KB 60K x 8 | A/D 16x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LPC1758FBD80,551 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tray | 2009 | LPC17xx | Discontinued | 2 (1 Year) | 80 | EAR99 | 12mm | ROHS3 Compliant | 80-LQFP | 12mm | Surface Mount | -40°C~85°C TA | CMOS | 1.6mm | 8542.31.00.01 | e3 | Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | NOT SPECIFIED | LPC1758 | 80 | YES | 0.5mm | S-PQFP-G80 | 2.4V | Microcontrollers | Not Qualified | 3.3V | 3.6V | 100MHz | Internal | ARM® Cortex®-M3 | 64K x 8 | 52 | 100mA | MICROCONTROLLER, RISC | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | 32 | YES | YES | YES | NO | 2.4V~3.6V | FLASH | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | 32-Bit | 512KB 512K x 8 | A/D 6x12b; D/A 1x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LPC1768FET100,551 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tray | 2009 | LPC17xx | Active | 3 (168 Hours) | 100 | EAR99 | 9mm | ROHS3 Compliant | 100-TFBGA | 9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | NOT SPECIFIED | LPC1768 | 100 | YES | 0.8mm | S-PBGA-B100 | 2.4V | Microcontrollers | Not Qualified | 3.3V | 3.6V | 100MHz | Internal | ARM® Cortex®-M3 | 64K x 8 | 70 | MICROCONTROLLER, RISC | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | 32 | YES | YES | YES | YES | 2.4V~3.6V | 524288 | CORTEX-M3 | FLASH | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | 32-Bit | 512KB 512K x 8 | A/D 8x12b; D/A 1x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LPC1769FBD100,551 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tray | 2007 | LPC17xx | Active | 3 (168 Hours) | 100 | EAR99 | 14mm | ROHS3 Compliant | 100-LQFP | 14mm | Surface Mount | -40°C~85°C TA | CMOS | 1.6mm | 8542.31.00.01 | e3 | Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | NOT SPECIFIED | LPC1769 | 100 | YES | 0.5mm | S-PQFP-G100 | 2.4V | Microcontrollers | Not Qualified | 3.3V | 3.6V | 120MHz | Internal | ARM® Cortex®-M3 | 64K x 8 | 70 | MICROCONTROLLER, RISC | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | 32 | YES | YES | YES | YES | 2.4V~3.6V | 524288 | FLASH | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | 32-Bit | 512KB 512K x 8 | A/D 8x12b; D/A 1x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MK60FN1M0VLQ12 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 13 Weeks | Tray | 2002 | Kinetis K60 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | 20mm | ROHS3 Compliant | 144-LQFP | 20mm | Surface Mount | -40°C~105°C TA | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3V | 40 | MK60FN1M0 | YES | 0.5mm | S-PQFP-G144 | 1.71V | Microcontrollers | Not Qualified | 1.8/3.3V | 3.6V | 120MHz | Internal | ARM® Cortex®-M4 | 128K x 8 | 100 | 177mA | MICROCONTROLLER, RISC | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | 32 | YES | YES | YES | YES | 1.71V~3.6V | 1048576 | CORTEX-M4F | FLASH | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32-Bit | 1MB 1M x 8 | A/D 58x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LPC4088FET208,551 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 18 Weeks | Tray | 2007 | LPC40xx | Active | 2 (1 Year) | 208 | 15mm | ROHS3 Compliant | 208-TFBGA | 15mm | Surface Mount | -40°C~85°C TA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 3.3V | LPC4088 | 208 | YES | 0.8mm | S-PBGA-B208 | 2.4V | Microcontrollers | Not Qualified | 3.3V | 3.6V | 120MHz | Internal | ARM® Cortex®-M4 | 96K x 8 | 165 | MICROCONTROLLER, RISC | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | 32 | YES | YES | YES | 2.4V~3.6V | 524288 | CORTEX-M4 | 4032 x 8 | FLASH | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32-Bit | 512KB 512K x 8 | A/D 8x12b; D/A 1x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LPC2138FBD64/01,15 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tray | 2003 | LPC2100 | Discontinued | 1 (Unlimited) | 64 | EAR99 | 10mm | ROHS3 Compliant | 64-LQFP | 10mm | Surface Mount | -40°C~85°C TA | CMOS | 1.6mm | 8542.31.00.01 | e3 | Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 40 | LPC2138 | 64 | YES | 0.5mm | S-PQFP-G64 | 3V | Microcontrollers | Not Qualified | 3.3V | 3.6V | 60MHz | Internal | ARM7® | 32K x 8 | 47 | 8 | 8 | MICROCONTROLLER, RISC | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | 32 | YES | NO | YES | YES | 3V~3.6V | 524288 | FLASH | I2C, Microwire, SPI, SSI, SSP, UART/USART | 16/32-Bit | 512KB 512K x 8 | A/D 16x10b; D/A 1x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MCF52258CAG66 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
10 Weeks | Tray | 2004 | MCF5225x | Active | 3 (168 Hours) | 144 | 5A992 | 20mm | ROHS3 Compliant | 144-LQFP | 20mm | Surface Mount | -40°C~85°C TA | CMOS | 8542.31.00.01 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 40 | MCF52258 | YES | 0.5mm | S-PQFP-G144 | 3V | Microcontrollers | Not Qualified | 3.3V | 3.6V | 66MHz | Internal | Coldfire V2 | 64K x 8 | 96 | MICROCONTROLLER, RISC | DMA, LVD, POR, PWM, WDT | 66MHz | 32 | YES | YES | YES | NO | 3V~3.6V | 524288 | FLASH | CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG | 32-Bit | 512KB 512K x 8 | A/D 8x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MK10DN512VLL10 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 13 Weeks | Tray | 2012 | Kinetis K10 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | 14mm | ROHS3 Compliant | 100-LQFP | 14mm | Surface Mount | -40°C~105°C TA | CMOS | 1.7mm | 8542.31.00.01 | e3 | Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 40 | MK10DN512 | YES | 0.5mm | S-PQFP-G100 | 1.71V | Microcontrollers | Not Qualified | 1.8/3.3V | 3.6V | 100MHz | Internal | ARM® Cortex®-M4 | 128K x 8 | 70 | 77mA | MICROCONTROLLER, RISC | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | 32 | YES | YES | YES | YES | 1.71V~3.6V | 524288 | CORTEX-M4 | FLASH | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32-Bit | 512KB 512K x 8 | A/D 37x16b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSP56F805FV80E | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 1998 | 56F8xx | Active | 3 (168 Hours) | 144 | 3A991.A.2 | 20mm | ROHS3 Compliant | 144-LQFP | 20mm | Surface Mount | -40°C~85°C TA | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 40 | DSP56F805 | YES | 0.5mm | S-PQFP-G144 | 3V | Digital Signal Processors | Not Qualified | 3.3V | 3.6V | 80MHz | External | 56800 | 2K x 16 | 32 | 16 | 152mA | YES | YES | 16 | FIXED POINT | YES | DIGITAL SIGNAL PROCESSOR, OTHER | POR, PWM, WDT | 80MHz | 2048 | 16 | 3V~3.6V | MULTIPLE | FLASH | CANbus, EBI/EMI, SCI, SPI | 16-Bit | 64KB 32K x 16 | A/D 8x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MK64FX512VDC12 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
13 Weeks | Tray | 2015 | Kinetis K60 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | ROHS3 Compliant | 121-XFBGA | Surface Mount | -40°C~105°C TA | CMOS | 8542.31.00.01 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 3.3V | 40 | YES | S-PBGA-B121 | 1.71V | 3.6V | 120MHz | Internal | ARM® Cortex®-M4 | 192K x 8 | 86 | MICROCONTROLLER, RISC | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | YES | YES | YES | YES | 1.71V~3.6V | 4K x 8 | FLASH | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32-Bit | 512KB 512K x 8 | A/D 37x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MK64FX512VLL12 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
13 Weeks | Tray | 2002 | Kinetis K60 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | 14mm | ROHS3 Compliant | 100-LQFP | 14mm | Surface Mount | -40°C~105°C TA | CMOS | 8542.31.00.01 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 40 | YES | 0.5mm | S-PQFP-G100 | 1.71V | 3.6V | 120MHz | Internal | ARM® Cortex®-M4 | 192K x 8 | 66 | MICROCONTROLLER, RISC | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | YES | YES | YES | YES | 1.71V~3.6V | 4K x 8 | FLASH | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32-Bit | 512KB 512K x 8 | A/D 32x16b; D/A 1x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LPC11U68JBD100E | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tray | 2010 | LPC11Uxx | Discontinued | 3 (168 Hours) | 100 | 14mm | ROHS3 Compliant | 100-LQFP | 14mm | Surface Mount | -40°C~105°C TA | CMOS | 1.6mm | QUAD | GULL WING | 260 | 3.3V | NOT SPECIFIED | LPC11U | 100 | YES | 0.5mm | S-PQFP-G100 | 2.4V | 3.6V | 50MHz | Internal | ARM® Cortex®-M0+ | 36K x 8 | 80 | MICROCONTROLLER, RISC | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | 32 | YES | YES | YES | NO | 2.4V~3.6V | 262144 | 8 | 4K x 8 | FLASH | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | 32-Bit | 256KB 256K x 8 | A/D 12x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MKL02Z32VFG4 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 13 Weeks | Tray | 2002 | Kinetis KL02 | Active | 3 (168 Hours) | 16 | 3A991.A.2 | 3mm | ROHS3 Compliant | 16-UFQFN Exposed Pad | 3mm | Surface Mount | -40°C~105°C TA | CMOS | 8542.31.00.01 | e3 | Matte Tin (Sn) | QUAD | NO LEAD | 260 | 3.3V | 40 | MKL02Z32 | YES | 0.5mm | S-PQCC-N16 | 1.71V | Microcontrollers | Not Qualified | 1.8/3.3V | 3.6V | 48MHz | Internal | ARM® Cortex®-M0+ | 4K x 8 | 14 | 6.4mA | MICROCONTROLLER, RISC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | 32 | YES | NO | YES | 1.71V~3.6V | 32768 | CORTEX-M0 | FLASH | I2C, SPI, UART/USART | 32-Bit | 32KB 32K x 8 | A/D 6x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PBLS1503V,115 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 2009 | Obsolete | 1 (Unlimited) | 6 | EAR99 | ROHS3 Compliant | BUILT-IN BIAS RESISTOR RATIO IS 1 | SOT-563, SOT-666 | Surface Mount | 8541.21.00.75 | e3 | Tin (Sn) | DUAL | FLAT | NOT SPECIFIED | NOT SPECIFIED | PBLS1503 | 6 | YES | R-PDSO-F6 | 150°C | Other Transistors | Not Qualified | 300mW | 2 | SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR | NPN AND PNP | 0.3W | SWITCHING | SILICON | 1 NPN Pre-Biased, 1 PNP | 280MHz | 1μA 100nA | 50V 15V | 100mA 500mA | 30 @ 5mA 5V / 150 @ 100mA. 2V | 150mV @ 500μA, 10mA / 250mV @ 50mA, 500mA | 280MHz | 10k Ω | 10k Ω | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NX3L4357GM,115 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Tape & Reel (TR) | 2010 | Active | 1 (Unlimited) | ROHS3 Compliant | 10-XFQFN | Surface Mount | -40°C~125°C TA | NX3L4357 | 10 | 1 | 750mOhm | 60MHz | SP3T | 1.4V~4.3V | 3:1 | 10nA | 35pF | 40ns, 20ns | 15pC | 90m Ω | -90dB @ 100kHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NX3L2467HR,115 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Tape & Reel (TR) | 2010 | Active | 1 (Unlimited) | ROHS3 Compliant | 16-XFQFN Exposed Pad | Surface Mount | -40°C~125°C TA | NX3L2467 | 16 | 2 | 750mOhm | 60MHz | DPDT | 1.4V~4.3V | 2:2 | 10nA | 35pF | 40ns, 20ns | 15pC | 70m Ω | -90dB @ 100kHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NX3L1G53GM,125 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Tape & Reel (TR) | 2009 | Active | 1 (Unlimited) | 8 | ROHS3 Compliant | 8-XFQFN Exposed Pad | Surface Mount | -40°C~125°C TA | CMOS | 0.5mm | 1 | e4 | NICKEL PALLADIUM GOLD | QUAD | NO LEAD | 260 | 1.65V | 30 | NX3L1G53G | 8 | YES | 0.5mm | S-PQCC-N8 | 1 | Multiplexer or Switches | Not Qualified | 4.3V | 1 | 750mOhm | 60MHz | 50ns | 23ns | BREAK-BEFORE-MAKE | 90 dB | 0.04Ohm | SPDT | 1.4V~4.3V | 2:1 | 10nA | 35pF | 24ns, 8ns | 15pC | 20m Ω | -90dB @ 100kHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NX3DV3899GU,115 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Cut Tape (CT) | 2011 | Active | 1 (Unlimited) | 16 | ROHS3 Compliant | 16-XFQFN | Surface Mount | -40°C~125°C TA | 2 | e3 | Matte Tin (Sn) | QUAD | NO LEAD | NOT SPECIFIED | NOT SPECIFIED | NX3DV3899 | 16 | YES | 0.4mm | R-PQCC-N16 | Multiplexer or Switches | Not Qualified | 1.4/4.3V | 2 | SEPARATE OUTPUT | 3.3Ohm | 200MHz | 90ns | BREAK-BEFORE-MAKE | DPDT | 1.4V~4.3V | 2:2 | 5nA | 8pF | 40ns, 20ns | 4pC | 700m Ω | -90dB @ 1MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NX3L1T3157GM,115 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Tape & Reel (TR) | 2010 | Active | 1 (Unlimited) | 6 | ROHS3 Compliant | 6-XFDFN | Surface Mount | -40°C~125°C TA | CMOS | 0.5mm | 1 | e3 | Tin (Sn) | DUAL | NO LEAD | 260 | 1.65V | 30 | NX3L1T3157G | 6 | YES | 0.5mm | R-PDSO-N6 | 1 | Multiplexer or Switches | Not Qualified | 4.3V | 1 | SEPARATE OUTPUT | 500mOhm | 60MHz | 90ns | BREAK-BEFORE-MAKE | 90 dB | 0.04Ohm | SPDT | 1.4V~4.3V | 2:1 | 10nA | 35pF | 40ns, 20ns | 15pC | 20m Ω | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
74HC58DB,112 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 74HC | Obsolete | 1 (Unlimited) | 14 | ROHS3 Compliant | ASYMMETRICAL I/P'S | 14-SSOP (0.209, 5.30mm Width) | 5.3mm | Surface Mount | CMOS | 2 | e4 | NICKEL PALLADIUM GOLD | DUAL | GULL WING | 260 | 5V | 30 | 74HC58 | 14 | Single-Ended | AUTOMOTIVE | YES | 0.65mm | R-PDSO-G14 | 2V | -40°C | 6V | 2 | 50pF | 35 ns | 10 Input (3, 3, 2, 2) | HC/UH | No | AND/OR Gate | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
74HC58N,652 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 74HC | Obsolete | 1 (Unlimited) | 14 | ROHS3 Compliant | ASYMMETRICAL I/P'S | 14-DIP (0.300, 7.62mm) | Through Hole | CMOS | 2 | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 5V | 30 | 74HC58 | 14 | Single-Ended | AUTOMOTIVE | NO | R-PDIP-T14 | 2V | -40°C | Gates | 6V | 2 | 50pF | 35 ns | 10 Input (3, 3, 2, 2) | HC/UH | 0.004 A | No | AND/OR Gate | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
HEF4000BT,653 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 1998 | 4000B | Obsolete | 1 (Unlimited) | 14 | 8.65mm | ROHS3 Compliant | MIXED WITH 1 INVERTER | 14-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C | CMOS | 1.75mm | 2 | e4 | NICKEL PALLADIUM GOLD | DUAL | GULL WING | 260 | 5V | 30 | 4000 | 14 | Single-Ended | YES | R-PDSO-G14 | 3V | Gates | 5/15V | 15V | 2 | 50pF | 140 ns | 7 Input (3, 3, 1) | 3V~15V | 0.00036 A | 140 ns | No | 3mA 3mA | NOR/INVERT Gate | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
74HC4067N,652 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | Obsolete | 1 (Unlimited) | 24 | ROHS3 Compliant | 24-DIP (0.600, 15.24mm) | Through Hole | -40°C~125°C TA | CMOS | 1 | e3 | TIN | DUAL | 260 | 5V | 30 | 74HC4067 | 24 | NO | 2.54mm | R-PDIP-T24 | 16 | Multiplexer or Switches | Not Qualified | 2/9V | SINGLE-ENDED MULTIPLEXER | 1 | 120Ohm | 100MHz | 450ns | 435ns | BREAK-BEFORE-MAKE | 50 dB | 9Ohm | 0.025A | 2V~10V | 16:1 | 100nA | 3.5pF | 45ns, 45ns | 6 Ω | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
74HCT4016N,112 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 1997 | Obsolete | 1 (Unlimited) | 14 | ROHS3 Compliant | 14-DIP (0.300, 7.62mm) | Through Hole | -40°C~125°C TA | CMOS | 4 | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 4.5V | 30 | 74HCT4016 | 14 | NO | R-PDIP-T14 | 1 | Multiplexer or Switches | Not Qualified | 5V | 5.5V | 2 | SEPARATE OUTPUT | 95Ohm | 200MHz | 35ns | 35ns | BREAK-BEFORE-MAKE | NO | 50 dB | 16Ohm | SPST - NO | 4.5V~5.5V | 1:1 | 1μA | 3.5pF | 30ns, 44ns | 5 Ω | -60dB @ 1MHz |
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