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NXP USA Inc.(17569)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Additional Feature | Package / Case | Interface | Reach Compliance Code | Width | Mounting Type | Operating Temperature | Technology | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Consumer IC Type | Analog IC - Other Type | Applications | Supply Current-Max (Isup) | Adjustable Threshold | Supplier Device Package | Speed | Core Processor | RAM Size | Number of I/O | Voltage - Supply | uPs/uCs/Peripheral ICs Type | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Program Memory Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ASC8850AETK | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
13 Weeks | Tray | 2015 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Surface Mount | ASC8850 | Embedded Multimedia Communication, Security and Entertainment | ARM9® | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912JP812AMAFR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 26 Weeks | Tape & Reel (TR) | 2012 | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | 14mm | ROHS3 Compliant | 100-LQFP Exposed Pad | CAN, SCI, SPI | 14mm | Surface Mount | -40°C~125°C | CMOS | 1.6mm | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 40 | MM912JP812 | YES | 0.5mm | S-PQFP-G100 | Engine Control | S12P | 6K x 8 | 8 | 4.7V~36V | MICROPROCESSOR CIRCUIT | FLASH (128kB) | HCS12 | |||||||||||||||||||||||||||||
| A7001CUHN1/T1AGBEJ | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
17 Weeks | Tape & Reel (TR) | 2011 | Obsolete | 1 (Unlimited) | 32-VFQFN Exposed Pad | I2C | Surface Mount | -25°C~85°C | Authentication | MX51 | 3.2kB | 1.62V~5.5V | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||
| A7102CGHN1/T0B04EL | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
2011 | Obsolete | 1 (Unlimited) | 32-VFQFN Exposed Pad | I2C | Surface Mount | -40°C~90°C TA | Authentication | MX51 | 1.62V~3.6V | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM783-TPE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2009 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 32-VQFN Exposed Pad | I2C, IrDA, SPI, UART/USART | Surface Mount | -40°C~85°C | Energy Measurement | 32-HVQFN (7x7) | ARM® Cortex®-M0 | 8K x 8 | 22 | 2.6V~3.6V | FLASH (32kB) | |||||||||||||||||||||||||||||||||||||||||||||||
| PNX9530E/V1,557 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | Obsolete | 1 (Unlimited) | 456-BGA | GPIO, Host Interface, I2C, PCI, USB, XIO | Surface Mount | -40°C~85°C TA | Multimedia | TriMedia™ | 8 | 1.16V~1.24V 3.15V~3.6V | Nexperia | |||||||||||||||||||||||||||||||||||||||||||||||||||
| PNX9530E/V140,518 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | Obsolete | 1 (Unlimited) | 456-BGA | GPIO, Host Interface, I2C, PCI, USB, XIO | Surface Mount | -40°C~85°C TA | Multimedia | TriMedia™ | 8 | 1.16V~1.24V 3.15V~3.6V | Nexperia | |||||||||||||||||||||||||||||||||||||||||||||||||||
| PNX9531E/V120,518 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | Obsolete | 1 (Unlimited) | 456-BGA | GPIO, Host Interface, I2C, PCI, USB, XIO | Surface Mount | -40°C~85°C TA | Multimedia | TriMedia™ | 8 | 1.16V~1.24V 3.15V~3.6V | Nexperia | |||||||||||||||||||||||||||||||||||||||||||||||||||
| A7102CGTK2/T0B042J | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tape & Reel (TR) | 2011 | Active | 8-VDFN Exposed Pad | I2C | Surface Mount | -40°C~90°C TA | Authentication | MX51 | 1.62V~3.6V | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGUK/T0B0407, | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
16 Weeks | Tape & Reel (TR) | 2011 | Active | 12-UFBGA, WLCSP | I2C | Surface Mount | -25°C~90°C TA | Authentication | MX51 | 1.62V~3.6V | EEPROM (20kB) | A710x | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912G634DV1AER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
16 Weeks | Tape & Reel (TR) | 2010 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | LIN, SCI | Surface Mount | -40°C~105°C | e3 | Matte Tin (Sn) | 260 | 40 | MM912G634 | ANALOG CIRCUIT | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||
| A7001CUHN1/T1AAKEL | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
26 Weeks | Active | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7005CGHN1/T1AGBEL | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
22 Weeks | 2011 | Active | 32-VFQFN Exposed Pad | I2C | Surface Mount | -25°C~85°C TA | Authentication | MX51 | 3.2kB | 1.62V~5.5V | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||
| A7006CGHN1/T1AGBEL | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
22 Weeks | 2011 | Active | 32-VFQFN Exposed Pad | I2C | Surface Mount | -40°C~90°C TA | Authentication | MX51 | 3.2kB | 1.62V~5.5V | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912G634DM1AE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
16 Weeks | Tray | 2010 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | LIN, SCI | Surface Mount | -40°C~105°C | e3 | Matte Tin (Sn) | 260 | 40 | MM912G634 | ANALOG CIRCUIT | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||
| MM908E624AYPEW | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
16 Weeks | Tube | 2003 | Active | 3 (168 Hours) | 54 | 3A991.A.2 | 17.9mm | ROHS3 Compliant | 54-BSSOP (0.295, 7.50mm Width) | SCI, SPI | 7.5mm | Surface Mount | -40°C~125°C | MOS | 2.65mm | 8542.39.00.01 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 9V | 40 | MM908E624 | YES | 0.65mm | R-PDSO-G54 | Microcontrollers | Not Qualified | Automotive Mirror Control | 32 MHz | HC08 | 512 x 8 | 16 | 5.5V~18V | MICROCONTROLLER | 9.8304MHz | 8 | YES | NO | YES | NO | FLASH (16kB) | 908E | |||||||||||||||||||
| MM912J637AM2EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
20 Weeks | Tape & Reel (TR) | 2012 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-VFQFN Exposed Pad | LIN, SCI, SPI | 7mm | Surface Mount | -40°C~125°C | BICMOS | 0.9mm | 1 | e3 | Matte Tin (Sn) | QUAD | NO LEAD | 260 | 40 | MM912J637 | YES | 0.5mm | 3.5V | 1 | Power Management Circuits | Not Qualified | POWER SUPPLY MANAGEMENT CIRCUIT | Battery Monitor | 25mA | YES | S12 | 6K x 8 | 8 | 2.25V~5.5V | FLASH (128kB) | HCS12 | ||||||||||||||||||||||||
| MM908E622ACEK | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | SCI, SPI | Surface Mount | -40°C~85°C | MM908E622 | Automotive Mirror Control | HC08 | 512 x 8 | 12 | 9V~16V | FLASH (16kB) | 908E | |||||||||||||||||||||||||||||||||||||||||||||||
| MM908E624AYEW | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 54-BSSOP (0.295, 7.50mm Width) | SCI, SPI | Surface Mount | -40°C~125°C | MM908E624 | Automotive Mirror Control | HC08 | 512 x 8 | 16 | 5.5V~18V | FLASH (16kB) | 908E | |||||||||||||||||||||||||||||||||||||||||||||||
| MM908E626AVDWB | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 2008 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | SCI, SPI | Surface Mount | -40°C~115°C | MM908E626 | Automotive Mirror Control | 54-SOIC-EP | HC08 | 512 x 8 | 13 | 8V~18V | FLASH (16kB) | 908E | |||||||||||||||||||||||||||||||||||||||||||||
| MM908E624AYEWR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 54-BSSOP (0.295, 7.50mm Width) | SCI, SPI | Surface Mount | -40°C~125°C | MM908E624 | Automotive Mirror Control | HC08 | 512 x 8 | 16 | 5.5V~18V | FLASH (16kB) | 908E | |||||||||||||||||||||||||||||||||||||||||||||||
| MM908E625ACDWB | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 2004 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | SCI, SPI | Surface Mount | -40°C~85°C | MM908E625 | Automotive Mirror Control | HC08 | 512 x 8 | 13 | 8V~18V | FLASH (16kB) | 908E | ||||||||||||||||||||||||||||||||||||||||||||||
| MM908E624ACDWB | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 54-BSSOP (0.295, 7.50mm Width) | SCI, SPI | Surface Mount | -40°C~85°C | MM908E624 | Automotive Mirror Control | HC08 | 512 x 8 | 16 | 5.5V~18V | FLASH (16kB) | 908E | |||||||||||||||||||||||||||||||||||||||||||||||
| MM908E624ACDWBR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 54-BSSOP (0.295, 7.50mm Width) | SCI, SPI | Surface Mount | -40°C~85°C | MM908E624 | Automotive Mirror Control | HC08 | 512 x 8 | 16 | 5.5V~18V | FLASH (16kB) | 908E | |||||||||||||||||||||||||||||||||||||||||||||||
| MM912I637AV1EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | 2012 | Obsolete | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-VFQFN Exposed Pad | LIN, SCI, SPI | 7mm | Surface Mount | -40°C~105°C | BICMOS | 0.9mm | 1 | e3 | Matte Tin (Sn) | QUAD | NO LEAD | 260 | 40 | MM912I637 | YES | 0.5mm | 3.5V | 1 | Power Management Circuits | Not Qualified | POWER SUPPLY MANAGEMENT CIRCUIT | Battery Monitor | 25mA | YES | S12 | 6K x 8 | 8 | 2.25V~5.5V | FLASH (96KB) | HCS12 | |||||||||||||||||||||||
| MM912F634CV2AER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 2010 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | LIN, SCI | Surface Mount | -40°C~105°C | MM912F634 | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||
| PNX1501E,557 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2002 | PNX15xx | Obsolete | 3 (168 Hours) | 456 | 27mm | ROHS3 Compliant | ALSO REQUIRES 3.3V SUPPLY | 456-BGA | I2C, 2-Wire Serial | unknown | 27mm | Surface Mount | 0°C~85°C | 2.45mm | 8542.39.00.01 | 1 | e0 | TIN LEAD | BOTTOM | BALL | 225 | 20 | PNX15* | 456 | YES | 1mm | S-PBGA-B456 | 3.13V | Other Consumer ICs | Not Qualified | 1.2V | 3.47V | CONSUMER CIRCUIT | Multimedia | TM3260 | 61 | 1.14V~1.26V | Nexperia | |||||||||||||||||||||||
| MM912F634CV1AER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 2010 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | LIN, SCI | Surface Mount | -40°C~105°C | MM912F634 | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||
| MM912F634BV1AE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2010 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | LIN, SCI | Surface Mount | -40°C~105°C | MM912F634 | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||
| A7101CHTK2/T0BC2VJ | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tape & Reel (TR) | A71CH | Active | 1 (Unlimited) | ROHS3 Compliant | 8-VDFN Exposed Pad | I2C | Surface Mount | -25°C~90°C TA | NOT SPECIFIED | 260 | NOT SPECIFIED | CONSUMER CIRCUIT | Authentication | MX51 | 2.5V~3.6V |