Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Reach Compliance Code | Density | Frequency | Height | Width | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Core Architecture | Speed | Output Characteristics | Access Time | Memory Size | Memory Type | Core Processor | RAM Size | Number of I/O | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Boundary Scan | Data Bus Width | Bus Compatibility | Architecture | uPs/uCs/Peripheral ICs Type | Peripherals | Parallel/Serial | Clock Frequency | RAM (words) | Standby Current-Max | Access Time (Max) | Programmable Type | Data Retention Time-Min | Endurance | I/O Type | Primary Attributes | Speed Grade | Connectivity |
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XCZU5EG-1FBVB900I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 900-BBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 204 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU4EV-2FBVB900I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | ROHS3 Compliant | 900-BBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 204 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z035-L2FFG900I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | 3A991.D | 31mm | ROHS3 Compliant | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 31mm | -40°C~100°C TJ | CMOS | 3.35mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | YES | 1mm | S-PBGA-B900 | 0.95V | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 275K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||
XAZU5EV-L1SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Active | 3 (168 Hours) | 784 | 23mm | ROHS3 Compliant | 23mm | CMOS | 3.32mm | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | INDUSTRIAL | YES | 0.8mm | S-PBGA-B784 | 100°C | -40°C | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z045-2FFG676E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 3A991.D | 1V | 27mm | ROHS3 Compliant | Copper, Silver, Tin | No | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 0°C~100°C TJ | CMOS | 3.37mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z045 | YES | 1mm | S-PBGA-B676 | 1.05V | ARM | ROMless | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 350K Logic Cells | -2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||
XCZU4EV-L2FBVB900E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | 900 | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 900-BBGA, FCBGA | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B900 | 0.698V | 0.742V | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 204 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC17S30XLVOG8I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 1998 | Obsolete | 3 (168 Hours) | 8 | EAR99 | 4.9mm | RoHS Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C | CMOS | SYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 3.3V | 30 | XC17S30XL | 8 | YES | 1.27mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 300kb | 0.005mA | 3V~3.6V | 1 | MEMORY CIRCUIT | 10MHz | 0.00005A | OTP | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
XC1701LPCG20C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2004 | yes | Obsolete | 3 (168 Hours) | 20 | 8.9662mm | RoHS Compliant | 20 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 20-LCC (J-Lead) | 8.9662mm | Surface Mount | 0°C~70°C | CMOS | SYNCHRONOUS | 4.572mm | 1 | e3 | Matte Tin (Sn) | QUAD | J BEND | 245 | 3.3V | 30 | XC1701L | 20 | YES | 1.27mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 1Mb | 0.01mA | 3V~3.6V | 1MX1 | 1 | 1048576 bit | CONFIGURATION MEMORY | SERIAL | 15MHz | 0.00005A | OTP | COMMON | |||||||||||||||||||||||||||||||||||||||||||
XC1736EPDG8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 2004 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 9.3599mm | RoHS Compliant | Lead Free | 8 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8-DIP (0.300, 7.62mm) | unknown | 7.62mm | Through Hole | 0°C~70°C | CMOS | SYNCHRONOUS | 4.5974mm | 1 | e3 | Matte Tin (Sn) | DUAL | 250 | 5V | 30 | XC1736E | 8 | NO | 2.54mm | 4.75V | Not Qualified | 5V | 5.25V | 3-STATE | 36kb | 0.01mA | 4.75V~5.25V | 1 | CONFIGURATION MEMORY | SERIAL | 10MHz | 0.00005A | OTP | COMMON | |||||||||||||||||||||||||||||||||||||||||||
XC17S30XLVOG8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 1999 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | 3.3V | 4.9mm | RoHS Compliant | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | 0°C~70°C | CMOS | 1.2mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 3.3V | 30 | XC17S30XL | 8 | YES | 1.27mm | 3V | 3.6V | 3-STATE | 300kb | 0.005mA | 3V~3.6V | 1 | MEMORY CIRCUIT | 10MHz | 0.00005A | OTP | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
XC1736ESOG8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 2004 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 4.9276mm | RoHS Compliant | Lead Free | 8 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8-SOIC (0.154, 3.90mm Width) | unknown | 3.937mm | Surface Mount | 0°C~70°C | CMOS | SYNCHRONOUS | 1.7272mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 5V | 40 | XC1736E | 8 | YES | 1.27mm | 4.75V | Not Qualified | 5V | 5.25V | 3-STATE | 36kb | 0.01mA | 4.75V~5.25V | 1 | CONFIGURATION MEMORY | SERIAL | 10MHz | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||||
XC17S200APDG8I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 1999 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 3.3V | 9.3599mm | RoHS Compliant | No | 8 | 8-DIP (0.300, 7.62mm) | 7.62mm | Through Hole | -40°C~85°C | CMOS | 4.5974mm | 1 | e3 | Matte Tin (Sn) | DUAL | 250 | 3.3V | 30 | XC17S200A | 8 | NO | 2.54mm | 3V | 3.6V | 3-STATE | 2Mb | 0.015mA | 3V~3.6V | 1 | CONFIGURATION MEMORY | SERIAL | 0.001A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||
XC1701LPDG8I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 2004 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 9.3599mm | RoHS Compliant | 8 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8-DIP (0.300, 7.62mm) | unknown | 7.62mm | Through Hole | -40°C~85°C | CMOS | SYNCHRONOUS | 4.5974mm | 1 | e3 | Matte Tin (Sn) | DUAL | 250 | 3.3V | 30 | XC1701L | 8 | NO | 2.54mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 1Mb | 0.01mA | 3V~3.6V | 1MX1 | 1 | CONFIGURATION MEMORY | SERIAL | 15MHz | 0.00005A | OTP | COMMON | |||||||||||||||||||||||||||||||||||||||||||
XC17S200APDG8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 1999 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 3.3V | 9.3599mm | RoHS Compliant | No | 8 | 8-DIP (0.300, 7.62mm) | 7.62mm | Through Hole | 0°C~70°C | CMOS | 4.5974mm | 1 | e3 | Matte Tin (Sn) | DUAL | 250 | 3.3V | 30 | XC17S200A | 8 | NO | 2.54mm | 3V | 3.6V | 3-STATE | 2Mb | 0.015mA | 3V~3.6V | 1 | CONFIGURATION MEMORY | SERIAL | 0.001A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||
XC17256EPCG20C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2004 | yes | Obsolete | 3 (168 Hours) | 20 | EAR99 | 8.9662mm | RoHS Compliant | 20 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 20-LCC (J-Lead) | unknown | 8.9662mm | Surface Mount | 0°C~70°C | CMOS | SYNCHRONOUS | 4.572mm | 8542.32.00.61 | 1 | e3 | Matte Tin (Sn) | QUAD | J BEND | 245 | 5V | 30 | XC17256E | 20 | YES | 1.27mm | 4.75V | Not Qualified | 5V | 5.25V | 3-STATE | 256Kb | 0.01mA | 4.75V~5.25V | 256KX1 | 1 | 262144 bit | CONFIGURATION MEMORY | SERIAL | 15MHz | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||
XC17128EVOG8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2004 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | 4.9276mm | RoHS Compliant | 8 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8-SOIC (0.154, 3.90mm Width) | 3.937mm | Surface Mount | 0°C~70°C | CMOS | SYNCHRONOUS | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 5V | 30 | XC17128E | 8 | YES | 1.27mm | 4.75V | Not Qualified | 5V | 5.25V | 3-STATE | 128kb | 0.01mA | 4.75V~5.25V | 1 | 131072 bit | CONFIGURATION MEMORY | SERIAL | 15MHz | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||||||
XC1701LPCG20I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2004 | yes | Obsolete | 3 (168 Hours) | 20 | EAR99 | 8.9662mm | RoHS Compliant | 20 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 20-LCC (J-Lead) | unknown | 8.9662mm | Surface Mount | -40°C~85°C | CMOS | SYNCHRONOUS | 4.572mm | 8542.32.00.61 | 1 | e3 | Matte Tin (Sn) | QUAD | J BEND | 245 | 3.3V | 30 | XC1701L | 20 | YES | 1.27mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 1Mb | 0.01mA | 3V~3.6V | 1MX1 | 1 | 1048576 bit | CONFIGURATION MEMORY | SERIAL | 15MHz | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||
XC17S20XLVOG8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 1999 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | 4.9mm | RoHS Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | 0°C~70°C | CMOS | SYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 3.3V | 30 | XC17S20XL | 8 | YES | 1.27mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 200kb | 0.005mA | 3V~3.6V | 179160X1 | 1 | 179160 bit | MEMORY CIRCUIT | 10MHz | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||||||
XC17S200AVOG8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 1999 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | 3.3V | 4.9mm | RoHS Compliant | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | 0°C~70°C | CMOS | 1.2mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 3.3V | 30 | XC17S200A | 8 | YES | 1.27mm | 3V | 3.6V | 3-STATE | 2Mb | 0.015mA | 3V~3.6V | 1 | CONFIGURATION MEMORY | SERIAL | 0.001A | OTP | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
XCF01SVO20C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 1999 | no | Active | 3 (168 Hours) | 20 | EAR99 | 3.3V | 6.5024mm | Non-RoHS Compliant | Contains Lead | No | 20 | 20-TSSOP (0.173, 4.40mm Width) | 4.4mm | Surface Mount | -40°C~85°C | CMOS | 1.19mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 3.3V | 30 | XCF*S | 20 | YES | 0.65mm | 3V | Flash Memories | 1.8/3.33V | 3.6V | 1Mb | 0.01mA | 3V~3.6V | 1MX1 | 1 | 1048576 bit | CONFIGURATION MEMORY | SERIAL | 0.001A | In System Programmable | 20 | ||||||||||||||||||||||||||||||||||||||||||
XCF08PFS48C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 1999 | no | Active | 3 (168 Hours) | 48 | EAR99 | 1.8V | 9mm | Non-RoHS Compliant | No | 48 | 48-TFBGA, CSPBGA | 860μm | 8mm | Surface Mount | -40°C~85°C | CMOS | 8542.32.00.51 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | XCF08PFS48C | 48 | 1.65V | Flash Memories | 2V | 8Mb | 0.04mA | 1.65V~2V | 8MX1 | 8388608 bit | CONFIGURATION MEMORY | SERIAL | 33MHz | 0.001A | In System Programmable | 20 | 20000 Write/Erase Cycles | |||||||||||||||||||||||||||||||||||||||||||||
XC18V512PC20C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tube | 1999 | no | Active | 3 (168 Hours) | 20 | EAR99 | 3.3V | 8.9662mm | Non-RoHS Compliant | Contains Lead | No | 20 | 20-LCC (J-Lead) | 512 kb | 8.9662mm | Surface Mount | 0°C~70°C | CMOS | 4.572mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 30 | XC18V512 | 20 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 64KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 20 | ||||||||||||||||||||||||||||||||||||||||||
XCF16PFS48C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 13 Weeks | Tray | 1999 | no | Active | 3 (168 Hours) | 48 | EAR99 | 1.8V | 9mm | Non-RoHS Compliant | No | 48 | 48-TFBGA, CSPBGA | 8mm | Surface Mount | -40°C~85°C | CMOS | 1.2mm | 8542.32.00.51 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | XCF16PFS48C | 48 | YES | 0.8mm | 1.65V | Flash Memories | 2V | 16Mb | 0.04mA | 1.65V~2V | 16MX1 | 1 | 16777216 bit | CONFIGURATION MEMORY | SERIAL | In System Programmable | 20 | 20000 Write/Erase Cycles | |||||||||||||||||||||||||||||||||||||||||||||
XC18V512SO20C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tube | 1999 | no | Active | 1 (Unlimited) | 20 | EAR99 | 3.3V | 12.827mm | Non-RoHS Compliant | Contains Lead | No | 20 | 20-SOIC (0.295, 7.50mm Width) | 512 kb | 7.5184mm | Surface Mount | 0°C~70°C | CMOS | 2.6416mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 3.3V | 30 | XC18V512 | 20 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 64KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 20 | ||||||||||||||||||||||||||||||||||||||||||
XC18V02VQ44C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 1998 | no | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 10mm | Non-RoHS Compliant | Contains Lead | No | 44 | 44-TQFP | 2 Mb | 10mm | Surface Mount | 0°C~70°C | CMOS | 1.2mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 30 | XC18V02 | 44 | YES | 0.8mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 256KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 20MHz | 0.01A | 20 ns | In System Programmable | 20 | 20000 Write/Erase Cycles | |||||||||||||||||||||||||||||||||||||||||
XC1736EVO8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 2000 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | 4.9276mm | Non-RoHS Compliant | Contains Lead | 8 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8-SOIC (0.154, 3.90mm Width) | not_compliant | 3.937mm | Surface Mount | 0°C~70°C | CMOS | SYNCHRONOUS | 1 | e0 | DUAL | GULL WING | 225 | 5V | 30 | XC1736E | 8 | YES | 1.27mm | 4.75V | Not Qualified | 5V | 5.25V | 3-STATE | 36kb | 0.01mA | 4.75V~5.25V | 1 | CONFIGURATION MEMORY | SERIAL | 10MHz | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||||||
XC17128EPD8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 2000 | Obsolete | Not Applicable | 8 | EAR99 | 9.3599mm | Non-RoHS Compliant | Contains Lead | 8 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8-DIP (0.300, 7.62mm) | not_compliant | 7.62mm | Through Hole | 0°C~70°C | CMOS | SYNCHRONOUS | 4.5974mm | 1 | e0 | DUAL | 225 | 5V | 30 | XC17128E | 8 | NO | 2.54mm | 4.75V | Not Qualified | 5V | 5.25V | 3-STATE | 128kb | 0.01mA | 4.75V~5.25V | 1 | 131072 bit | CONFIGURATION MEMORY | SERIAL | 15MHz | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||||||
XC18V02PCG44C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 1999 | yes | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 16.5862mm | ROHS3 Compliant | No | 44 | 44-LCC (J-Lead) | 2 Mb | 16.5862mm | Surface Mount | 0°C~70°C | CMOS | 4.572mm | 1 | e3 | Matte Tin (Sn) | QUAD | J BEND | 245 | 3.3V | 30 | XC18V02 | 44 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 256KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 20MHz | 0.01A | 20 ns | In System Programmable | 20 | 20000 Write/Erase Cycles | ||||||||||||||||||||||||||||||||||||||||||
XC18V04VQG44C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 1999 | yes | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 10mm | ROHS3 Compliant | 44 | 44-TQFP | Parallel, Serial | 4 Mb | 1mm | 10mm | Surface Mount | 0°C~70°C | CMOS | SYNCHRONOUS | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 30 | XC18V04 | 44 | 0.8mm | 3V | Flash Memories | Not Qualified | 3.6V | 10 ns | 0.025mA | 3V~3.6V | 512KX8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 20MHz | 0.01A | In System Programmable | 20 | 20000 Write/Erase Cycles | ||||||||||||||||||||||||||||||||||||||||
XC18V04PC44C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tube | 1998 | no | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 16.5862mm | Non-RoHS Compliant | Contains Lead | No | 44 | 44-LCC (J-Lead) | 4 Mb | 16.5862mm | Surface Mount | 0°C~70°C | CMOS | 4.572mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 30 | XC18V04 | 44 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 512KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 20MHz | 0.01A | 20 ns | In System Programmable | 20 | 20000 Write/Erase Cycles |
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