All Products
-
Integrated Circuits (ICs)
- Integrated Circuits (ICs)
- AC to DC Converter ICs
- Active Filters
- ADC
- AFE
- Analog Multipliers & Dividers
- Analog Switches & Multiplexers ICs
- Application Specific Microcontrollers
- Application Specific Timer
- Audio Amplifiers
- Audio Special Purpose
- Battery Chargers ICs
- Battery Management ICs
- Buffers & Transceivers
- Capacitive Sensors
- Clock Buffers & Drivers
- Clock Generators
- CODECs Interface ICs
- Comparators
- Configuration Proms for FPGAs
- Controllers Interface ICs
- Converting Interface ICs
- Counters & Dividers
- CPLDs
- Current Regulator IC
- DAC
- DC DC Voltage Regulators
- DC to DC converter
- DDS
- Delay Lines Timing ICs
- Digital Potentiometers
- Display Drivers ICs
- Drivers Interface ICs
- DSP
- Embedded ICs Modules
- Energy Metering ICs
- FIFOs Memory
- Flip Flops
- FPGAs
- FPGAs with Microcontrollers
- Full & Half-Bridge Drivers ICs
- Gate Drivers ICs
- Gates & Inverters
- Hot Swap Controllers
- I/O Expanders
- IC Batteries
- Ideal Diode controller
- Instrumentational OP Amps
- Interface ICs Modules
- Laser Driver ICs
- Latches
- LED Driver ICs
- Lighting Controllers
- Linear Comparators
- Linear Regulator Controllers
- Linear Voltage Regulators
- Memory
- Memory Batteries
- Memory Controllers
- Microcontrollers
- Microprocessors
- Modems ICs & Modules
- Motor Drivers
- Multi-Functional Gates & Inverters
- Multivibrators
- Multivibrators
- PFC PMICs
- PLDs
- PoE Controllers
- Power Supply Control ICs
- Power Switches ICs
- Programmable Timers & Oscillators
- RMS to DC Converters
- RTCs
- Sensor & Detector Interface ICs
- Serializers & Deserializers
- Shift Registers
- Signal Buffers
- Signal Switches & Multiplexers
- Signal Terminators
- SoC
- Special Purpose ADCs/DACs
- Special Purpose Amplifiers
- Special Purpose Analog Switches
- Specialized ICs
- Specialized Interface ICs
- Specialized Power Management ICs
- Specialized Voltage Regulators
- Specialty Logic ICs
- Switching Voltage Regulators
- Telecom Interface ICs
- Thermal Management
- Touch Screen Controllers
- UARTs
- Universal Bus Functions
- V/F & F/V Converters
- Video Amps & Modules
- Video Processing Linear ICs
- Voice Record and Playback
- Voltage Reference
- Voltage Supervisors
- Voltage Translators & Level Shifters
-
Connectors
- Connectors
- ARINC Connectors
- Backplane Connector Contacts
- Backplane Connectors Accessories
- Backplane Connectors Housings
- Backshells and Cable Clamps
- Banana Tip Adapters
- Banana Tip Binding Posts
- Banana Tip Connectors Accessories
- Banana Tip Jacks
- Barrel Accessories
- Barrel Adapters
- Barrel Audio Connectors
- Barrel Connectors
- Barrel Power Connectors
- Barrier Terminal Blocks
- Between Series Adapters
- Blade Type Power Connectors
- Blade Type Power Connectors
- Blade Type Power Connectors Accessories
- Blade Type Power Connectors Housings
- Board In Connectors
- Board to Board Connectors
- Card Edge Adapters
- Card Edge Connectors Accessories
- Card Edge Connectors Housings
- Card Edge Contacts
- Centronics Connectors
- Circular Adapters
- Circular Connectors
- Circular Connectors Accessories
- Circular Connectors Housings
- Circular Contacts
- Coaxial Connectors
- Coaxial Connectors Accessories
- D-Sub Adapters
- D-Sub Connector Housings
- D-Sub Connector Terminators
- D-Sub Connectors
- D-Sub Connectors Accessories
- D-Sub Contacts
- D-Sub Hoods
- D-Sub Jackscrews
- DIN 41612 Connectors
- Din Rail Terminal Blocks
- Edgeboard Connectors
- Faceplates & Frames
- Fiber Optic Adapters
- Fiber Optic Connectors
- Fiber Optic Connectors Accessories
- Fiber Optic Connectors Housings
- Flat Flexible Connector Housings
- Flat Flexible Connectors
- Flat Flexible Connectors Accessories
- Flat Flexible Contacts
- Foil Connectors
- Hard Metric Connector
- Headers & Male Pins
- Heavy Duty Connectors Accessories
- Heavy Duty Connectors Assemblies
- Heavy Duty Connectors Frames
- Heavy Duty Connectors Housings
- Heavy Duty Connectors Modules
- Heavy Duty Contacts
- IC Adapters
- IC and Component Sockets
- IC Sockets Accessories
- Inline Memory Module Sockets
- Interface Modules Terminal Blocks
- Keystone Accessories
- Keystone Inserts
- Knife Connectors
- Leadframe Contacts
- LGH Connectors
- Magnetic Wire Terminals
- Magnetics Modular Jacks
- Memory Card Adapters
- Memory Card Sockets
- Memory Connectors Accessories
- Modular Adapters
- Modular Connectors Accessories
- Modular Jacks
- Modular Plug Housings
- Modular Plugs
- Multi Purpose Contacts
- Panel Mount Connectors
- Panel Mount Terminal Blocks
- PC Pin Terminals
- Photovoltaic Connectors
- Photovoltaic Connectors Accessories
- Photovoltaic Contacts
- Pluggable Connectors
- Pluggable Connectors Accessories
- Pluggable Terminal Blocks
- Power Distribution Terminal Blocks
- Power Entry Connectors Accessories
- Power Entry Connectors Modules
- Quick-Connect & Quick-Disconnect Connectors
- Rectangular Connectors
- Rectangular Connectors Accessories
- Rectangular Connectors Adapters
- Rectangular Connectors Arrays
- Rectangular Connectors Headers
- Rectangular Connectors Housings
- Rectangular Contact Inserts
- Rectangular Terminals
- RF Adapters
- RF Contacts
- RF Terminators
- Ring Terminals
- Screw Connectors
- Shunts & Jumpers
- Socket Terminals
- Solder Lug Connectors
- Spade Connectors
- Specialized Backplane Connectors
- Specialized Connectors
- Specialized Terminal Blocks
- Spring Loaded Contacts
- Spring Loaded Rectangular Connectors
- SSL Connectors
- SSL Connectors Accessories
- SSL Contacts
- Terminal Block Adapters
- Terminal Blocks - Contacts
- Terminal Blocks Accessories
- Terminal Jumpers
- Terminal Junction Systems
- Terminal Marker Strips
- Terminal Strips and Turret Boards
- Terminal Wire Ferrules
- Terminals Accessories
- Terminals Adapters
- Terminals Housings
- Transistor Sockets
- Turret Connectors
- Video Adapters
- Video Connector Accessories
- Video Connectors
- Wire Pin Connectors
- Wire Splice Connectors
- Wire-to-Board Connectors
- Wire-to-Board Terminal Blocks
- Wiring Blocks Accessories
- Wiring Modular Connectors
-
Discrete Semiconductors
- Discrete Semiconductors
- Arrays BJT Transistors
- BJT Transistors Arrays
- Bridge Rectifiers
- DIACs and SIDACs
- IGBTs Modules
- IGBTs Transistors Arrays
- JFETs Transistors
- MOSFETs Transistors Arrays
- Power Driver Modules
- Pre-Biased BJT Transistors
- Programmable Unijunction Transistors
- Rectifier Diode Array
- RF BJT Transistors
- RF Diodes
- RF MOSFETs Transistors
- SCRs Thyristors
- Single BJT Transistors
- Single IGBTs
- Single IGBTs
- Single MOSFETs Transistors
- Single-Phase Diode Rectifier
- Specialized Transistors
- Thyristors Modules
- TRIACs Thyristors
- Varactors
- Zener Diode Arrays
- Zener Single Diodes
-
Capacitors
- Capacitors
- Aluminum Electrolytic Capacitors
- Aluminum Polymer Capacitors
- Capacitor Accessories
- Capacitor Networks
- Ceramic Capacitors
- Ceramic Capacitors
- Film Capacitors
- Mica & PTFE Capacitors
- Niobium Oxide Capacitors
- Silicon Capacitors
- Supercapacitors & EDLC
- Tantalum Capacitors
- Tantalum Polymer Capacitors
- Thin Film Capacitors
- Trimmers Variable
-
Sensors
- Sensors
- CdS Cells
- Accelerometers
- Accessories
- Amplifiers
- Analog & Digital Sensor
- Analog & Digital Sensors
- Analog Optical Sensors
- Angle & Linear Position Measuring Sensors
- Camera Modules
- Color Sensors
- Current Sensors
- Distance Measuring Sensors
- Dust Sensors
- Encoders
- Float & Level Sensors
- Flow Sensors
- Force Sensors
- Gas Sensors
- Gyroscopes
- Humidity Sensors
- Image Sensors
- IMUs
- Inclinometers
- IrDA Transceiver Modules
- Junction Blocks
- Logic Optical Sensors
- Logic Photo Detectors
- Logic Photointerrupters
- LVDT Transducers
- Magnetic Compass Sensors Modules
- Magnetic Linear Sensors ICs
- Magnetic Position Sensors Modules
- Magnetic Switches
- Mechanical Temperature Sensors
- Multi Purpose Magnets
- Multifunction
- NTC Thermistors
- Occupancy Sensors
- Optical Motion Sensors
- Optical Sensors Remote Receiver
- Photodiodes
- Photoelectric Sensors
- Phototransistors
- Proximity Sensors
- PTC Thermistors
- RTD
- Sensor Cable Accessories
- Sensor Cable Assemblies
- Sensor Matched Magnets
- Shock Sensors
- Solar Cells
- Solid State Thermostats
- Specialized Sensors
- Strain Gauges
- Thermocouple Temperature Sensors
- Tilt Switch Sensors
- Touch Sensors
- Transducers
- Transistor Optical Sensors
- Ultrasonic Receivers
- UV Sensors
- Vibration Sensors
- Resistors
- Isolators
- Board Mount Poser Supplies
-
RF/IF & RFID
- RF/IF & RFID
- Attenuators
- Balun
- RF Accessories
- RF Amplifiers
- RF Antennas
- RF Boards
- RF Demodulators
- RF Detectors
- RF Directional Coupler
- RF Front End
- RF Misc ICs and Modules
- RF Mixers
- RF Modulators
- RF Multiplexers
- RF Power Controller ICs
- RF Power Dividers
- RF Receivers
- RF Shields
- RF Switches
- RF Transceiver ICs
- RF Transceiver Modules
- RF Transmitter
- RF Transmitters
- RFI & EMI Contacts
- RFI & EMI Materials
- RFID Accessories
- RFID Antennas
- RFID Boards
- RFID ICs
- RFID Reader Modules
- RFID Tags
- Circuit Protection
- Crystals
- Inductors
- Filters
Xilinx Inc.(2351)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Min Supply Voltage | Frequency | Width | Operating Temperature | Technology | Height Seated (Max) | HTS Code | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Propagation Delay | Supplier Device Package | Core Architecture | Speed | Memory Type | Core Processor | RAM Size | Number of I/O | Boundary Scan | Data Bus Width | Bus Compatibility | Architecture | uPs/uCs/Peripheral ICs Type | Peripherals | Clock Frequency | RAM (words) | UV Erasable | Primary Attributes | Number of Logic Elements/Cells | Speed Grade | Number of Registers | Connectivity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCZU2CG-2SBVA484I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 484 | ROHS3 Compliant | 484-BFBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | R-PBGA-B484 | 0.876V | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 82 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||
| XCZU9EG-2FFVC900I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 900-BBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 204 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-2SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 784 | ROHS3 Compliant | 784-BFBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | R-PBGA-B784 | 0.825V | 0.876V | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||
| XCZU9EG-2FFVB1156E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 1156-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 328 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z014S-2CLG400I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 400 | 17mm | ROHS3 Compliant | 400-LFBGA, CSPBGA | 17mm | -40°C~100°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B400 | 0.95V | 1.05V | 766MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 125 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 800MHz | 256000 | Artix™-7 FPGA, 65K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||
| XCZU9EG-2FFVC900E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 900-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 204 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z014S-1CLG484I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 484 | 19mm | ROHS3 Compliant | 484-LFBGA, CSPBGA | 19mm | -40°C~100°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B484 | 0.95V | 1.05V | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 200 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 667MHz | 256000 | Artix™-7 FPGA, 65K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||
| XC7Z035-2FFG900I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | 3A991.D | 31mm | ROHS3 Compliant | Copper, Silver, Tin | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 800MHz | 31mm | -40°C~100°C TJ | CMOS | 3.35mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | 1mm | S-PBGA-B900 | 100 ps | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | MCU, FPGA | DMA | Kintex™-7 FPGA, 275K Logic Cells | 2 | 343800 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||
| XC7Z020-2CLG484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 3 (168 Hours) | 484 | 3A991.D | 1V | 19mm | ROHS3 Compliant | Copper, Silver, Tin | No | 484 | 484-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 766MHz | 0°C~100°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 260 | 1V | 30 | XC7Z020 | YES | 0.8mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Artix™-7 FPGA, 85K Logic Cells | -2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||
| XCZU4EV-1SFVC784E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z012S-2CLG485I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 485 | 19mm | ROHS3 Compliant | 484-LFBGA, CSPBGA | 19mm | -40°C~100°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B485 | 0.95V | 1.05V | 766MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 150 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 800MHz | 256000 | Artix™-7 FPGA, 55K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||
| XCZU3CG-1SFVA625E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 625-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 180 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3CG-2SFVC784E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-1SBG485I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 485 | EAR99 | 19mm | ROHS3 Compliant | Copper, Silver, Tin | 485 | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 484-FBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~100°C TJ | CMOS | 2.44mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | 0.8mm | 0.95V | Other Microprocessor ICs | Not Qualified | 11.8V | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA | 256000 | N | Kintex™-7 FPGA, 125K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||
| XC7Z010-1CLG400C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2010 | Zynq®-7000 | Active | 3 (168 Hours) | 400 | EAR99 | 1V | 17mm | ROHS3 Compliant | Copper, Silver, Tin | No | 400 | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 0°C~85°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | XC7Z010 | YES | 0.8mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Artix™-7 FPGA, 28K Logic Cells | -1 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||
| XC7Z010-2CLG400I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2010 | Zynq®-7000 | Active | 3 (168 Hours) | 400 | EAR99 | 1V | 17mm | ROHS3 Compliant | Copper, Silver, Tin | No | 400 | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 766MHz | -40°C~100°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 30 | XC7Z010 | YES | 0.8mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Artix™-7 FPGA, 28K Logic Cells | -2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||
| XC7Z015-2CLG485I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2010 | Zynq®-7000 | Active | 3 (168 Hours) | 100°C | -40°C | ROHS3 Compliant | Copper, Silver, Tin | 485 | 484-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 766MHz | -40°C~100°C TJ | 766MHz | 485-CSBGA (19x19) | ARM | 766MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | 32b | MCU, FPGA | DMA | Artix™-7 FPGA, 74K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||
| XA7Z020-1CLG484Q | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2009 | Automotive, AEC-Q100, Zynq®-7000 XA | Active | 3 (168 Hours) | 484 | 3A991.D | 1V | 19mm | ROHS3 Compliant | Copper, Silver, Tin | 484 | 484-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~125°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | TIN SILVER COPPER | BOTTOM | BALL | NOT SPECIFIED | NOT SPECIFIED | 0.8mm | Other uPs/uCs/Peripheral ICs | Not Qualified | 11.8V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA | N | Artix™-7 FPGA, 85K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||
| XC7Z030-1SBG485C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 485 | EAR99 | 19mm | ROHS3 Compliant | Copper, Silver, Tin | 485 | 484-FBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 0°C~85°C TJ | CMOS | 2.44mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | 0.95V | Other Microprocessor ICs | Not Qualified | 11.8V | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA | 256000 | N | Kintex™-7 FPGA, 125K Logic Cells | -1 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||
| XC7Z020-1CLG400C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 3 (168 Hours) | 400 | EAR99 | 1V | 17mm | ROHS3 Compliant | Copper, Silver, Tin | No | 400 | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 0°C~85°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | XC7Z020 | YES | 0.8mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Artix™-7 FPGA, 85K Logic Cells | -1 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||
| XA7Z020-1CLG400Q | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | Active | 3 (168 Hours) | 400 | EAR99 | 1V | 17mm | ROHS3 Compliant | Copper, Silver, Tin | 400 | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~125°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | NOT SPECIFIED | 0.8mm | Other uPs/uCs/Peripheral ICs | Not Qualified | 11.8V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA | N | Artix™-7 FPGA, 85K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||
| XC7Z030-1FBG484C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 484 | EAR99 | 1V | 23mm | ROHS3 Compliant | Copper, Silver, Tin | No | 484 | 484-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 0°C~85°C TJ | CMOS | 2.54mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1V | 30 | XC7Z030 | YES | 1mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 125K Logic Cells | -1 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||
| XC7Z045-2FFG676I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 3A991.D | 1V | 27mm | ROHS3 Compliant | Copper, Silver, Tin | No | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | -40°C~100°C TJ | CMOS | 3.37mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z045 | YES | 1mm | S-PBGA-B676 | 1.05V | ARM | ROMless | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 350K Logic Cells | -2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||
| XC7Z045-1FFG900C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | 3A991.D | 31mm | ROHS3 Compliant | Copper, Silver, Tin | No | 900 | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3.3V | 1.2V | 667MHz | 0°C~85°C TJ | CMOS | 3.35mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z045 | YES | 1mm | ARM | ROMless | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 350K Logic Cells | 190000 | -1 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||
| XCZU3CG-L1SBVA484I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 484 | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 484-BFBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B484 | 0.698V | 0.742V | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 82 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||
| XC7Z030-3FFG676E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 3A991.D | 1V | 27mm | ROHS3 Compliant | Copper, Silver, Tin | No | 676 | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1GHz | 0°C~100°C TJ | CMOS | 3.24mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z030 | YES | 1mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 125K Logic Cells | -3 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||
| XCZU2EG-1SFVC784E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3CG-1SBVA484I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 484-BFBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 82 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3EG-1SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-L2FFG676I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 3A991.D | 27mm | ROHS3 Compliant | Copper, Silver, Tin | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 800MHz | 27mm | -40°C~100°C TJ | CMOS | 3.24mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | 1mm | S-PBGA-B676 | 100 ps | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 125K Logic Cells | 157200 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |