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0077001219

0077001219 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel


  • Manufacturer: Laird Technologies EMI
  • Origchip NO: 445-0077001219
  • Package: -
  • Datasheet: PDF
  • Stock: 893
  • Description: 0077001219 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 4 Weeks
Material Beryllium Copper
Operating Temperature 121°C
Series No Snag
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Fingerstock
Plating Nickel
Attachment Method Adhesive
Height 0.110 2.79mm
Length 24.000 609.60mm
Width 0.320 8.13mm
Plating Thickness 299.21μin 7.60μm
Thickness 50.8μm
RoHS Status RoHS Compliant

0077001219 Overview


Contact RFI is packaged with the materials of Beryllium Copper.It is possible for the EMI/RFI to operate normally at 121°C.Type Fingerstock from the contacter RFI.RFI EMIs from the well-known No Snag series product line are featured in this RFI EMI.

0077001219 Features


Fingerstock
No Snag series

0077001219 Applications


There are a lot of Laird Technologies EMI 0077001219 RFI and EMI Contacts applications.

  • Smart Energy
  • LED Lighting
  • Health care
  • Fitness
  • Low Noise Amplifier
  • Receive
  • Switch
  • Internet of Things
  • Digital Remote
  • Thermostats